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Suggested Items

The Knowledge Base: A Conference for Cleaning and Coating of Mission-critical Electronics

07/08/2025 | Mike Konrad -- Column: The Knowledge Base
In electronics manufacturing, there’s a dangerous misconception that cleaning and coating are standalone options, that they operate in different lanes, and that one can compensate for the other. Let’s clear that up now. Cleaning and conformal coating are not separate decisions. They are two chapters in the same story—the story of reliability.

IPC Releases Latest Standards and Revisions Updates

06/05/2025 | IPC
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.

The Knowledge Base: Challenges and Considerations of Harsh Environments

02/26/2025 | Mike Konrad -- Column: The Knowledge Base
In today’s rapidly advancing technological landscape, electronic assemblies are increasingly being deployed into environments that push their design and material limits. From the corrosive atmospheres of industrial facilities to the extreme temperatures and humidity of outdoor applications, harsh environments present a significant challenge to the reliability of electronic devices. This column explores the key issues impacting electronics reliability in such conditions, including electrochemical migration (ECM), corrosion, and the role of residue tolerance in assembly design. 

EpoxySet to Feature State-of-the-ART Engineered UV cured products at The ASSEMBLY Show

08/28/2024 | epoxySet
EpoxySet Inc. will be showcasing our extensive line of high-tech, UV/light cure adhesives at booth #1040 at The ASSEMBLY Show, October 22nd-24th, 2024, Rosemount, Illinois.  

High Temperature Component Warpage as a Function of Moisture Sensitivity (MSL) Rating

05/29/2024 | Neil Hubble, Akrometrix
Moisture sensitivity requirements for non-hermetic surface mount devices are defined in the joint IPC/JEDEC standard J-STD-020E, “Joint IPC/JEDEC Standard for Moisture/Reflow Sensitivity Classification for Non-hermetic Surface-Mount Devices,” last updated in December 2014. This standard allows customers and suppliers to place electronics devices into specific categories, defined into 8 different moisture sensitivity levels (MSL). Test method criteria are defined within this standard to define MSL levels for different packages. A subsection of MSLs are shown in Figure 1 below, showing the MSL 3 and 4 used in this study.
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