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Sealed for Survival: Potting Electronics for the Toughest Environments

10/29/2025 | Beth Massey, MacDermid Alpha Electronics Solutions
Electronics deployed in harsh conditions face relentless threats from vibration, impact, chemical contaminants, airborne pollutants, and moisture, conditions that can quickly lead to failure without robust protection. Potting, the process of encapsulating electronics in a protective polymer, is a widely used strategy to safeguard devices from both environmental and mechanical hazards.

Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging

09/17/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
Electronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.

The Knowledge Base: A Conference for Cleaning and Coating of Mission-critical Electronics

07/08/2025 | Mike Konrad -- Column: The Knowledge Base
In electronics manufacturing, there’s a dangerous misconception that cleaning and coating are standalone options, that they operate in different lanes, and that one can compensate for the other. Let’s clear that up now. Cleaning and conformal coating are not separate decisions. They are two chapters in the same story—the story of reliability.

IPC Releases Latest Standards and Revisions Updates

06/05/2025 | IPC
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.

The Knowledge Base: Challenges and Considerations of Harsh Environments

02/26/2025 | Mike Konrad -- Column: The Knowledge Base
In today’s rapidly advancing technological landscape, electronic assemblies are increasingly being deployed into environments that push their design and material limits. From the corrosive atmospheres of industrial facilities to the extreme temperatures and humidity of outdoor applications, harsh environments present a significant challenge to the reliability of electronic devices. This column explores the key issues impacting electronics reliability in such conditions, including electrochemical migration (ECM), corrosion, and the role of residue tolerance in assembly design. 
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