Global Foldable Phones Market to See CAGR of 24.6% from 2019 to 2025
May 14, 2019 | Globe NewswireEstimated reading time: 1 minute
The global foldable phones market is expected to witness a CAGR of 24.6% from 2019 to 2025. Advent of nascent technology attracting the target demographic is expected to drive the market growth over the forecast period. Moreover, advantages over existing technologies in the market will propel the market growth in the coming years.
Foldable phones are at the forefront of smartphone technology set to be commercialized in the year 2019. Combining the attributes of a large-screen tab with the portability of smartphones is expected to attract the customer base. New entrants, such as Samsung and Huawei will set the trend of this new technology and solidify their position in the market. Major players are anticipated to enter the market by the year 2020. Foldable phones have high cost; therefore, an economic version is likely to flood the market in the coming years. Additionally, new folding technology is also anticipated to enter the market over the forecast period, for instance, Apple, Inc. has patented its folding phone with a hinge heating technology to protect it from damage incurred in use overtime.
Outwards Segment: the Fastest CAGR from 2019 to 2025
Based on folding technology, outwards segment is anticipated to register the fastest CAGR from 2019 to 2025. This can be attributed to the wedge problem faced in the inward folding smartphones. Smartphone with inward folding screen, such as the Samsung Galaxy Fold experiences a wedge formation in the middle of the screen. However, the outwards folding smartphones, for instance, the Huawei Mate X folds outwards generate less pressure on the screen. This results in minimal curve formation on the screen.
Foldable Phones - Regional insight
Asia-Pacific is expected to hold the largest share of the market over the forecast period. Rise in per capita income of the target demographic of this region is anticipated to drive the market growth in the coming years. Moreover, decrease in the cost of these devices due to presence of ubiquitous electronics manufacturing units in this region is expected to drive the market growth over the forecast period. Additionally, presence of key players in this region is expected to give impetus to the market growth from 2019-2025.
Suggested Items
Biden-Harris Administration Announces CHIPS Incentives Awards with BAE Systems, Rocket Lab
11/25/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Aeluma Secures NASA Contract to Advance Quantum Dot Photonic Integrated Circuits for Aerospace and AI Applications
11/25/2024 | ACCESSWIREAeluma, Inc., a semiconductor company specializing in high-performance, scalable technologies for mobile, automotive, AI, defense and aerospace, communication and quantum computing, announced it has been awarded a contract by NASA to develop quantum dot photonic integrated circuits (PICs) on silicon.
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.