Global Foldable Phones Market to See CAGR of 24.6% from 2019 to 2025
May 14, 2019 | Globe NewswireEstimated reading time: 1 minute
The global foldable phones market is expected to witness a CAGR of 24.6% from 2019 to 2025. Advent of nascent technology attracting the target demographic is expected to drive the market growth over the forecast period. Moreover, advantages over existing technologies in the market will propel the market growth in the coming years.
Foldable phones are at the forefront of smartphone technology set to be commercialized in the year 2019. Combining the attributes of a large-screen tab with the portability of smartphones is expected to attract the customer base. New entrants, such as Samsung and Huawei will set the trend of this new technology and solidify their position in the market. Major players are anticipated to enter the market by the year 2020. Foldable phones have high cost; therefore, an economic version is likely to flood the market in the coming years. Additionally, new folding technology is also anticipated to enter the market over the forecast period, for instance, Apple, Inc. has patented its folding phone with a hinge heating technology to protect it from damage incurred in use overtime.
Outwards Segment: the Fastest CAGR from 2019 to 2025
Based on folding technology, outwards segment is anticipated to register the fastest CAGR from 2019 to 2025. This can be attributed to the wedge problem faced in the inward folding smartphones. Smartphone with inward folding screen, such as the Samsung Galaxy Fold experiences a wedge formation in the middle of the screen. However, the outwards folding smartphones, for instance, the Huawei Mate X folds outwards generate less pressure on the screen. This results in minimal curve formation on the screen.
Foldable Phones - Regional insight
Asia-Pacific is expected to hold the largest share of the market over the forecast period. Rise in per capita income of the target demographic of this region is anticipated to drive the market growth in the coming years. Moreover, decrease in the cost of these devices due to presence of ubiquitous electronics manufacturing units in this region is expected to drive the market growth over the forecast period. Additionally, presence of key players in this region is expected to give impetus to the market growth from 2019-2025.
Suggested Items
Micross, Sital Announce Global Manufacturing & Distribution Partnership
05/07/2024 | Micross Components, Inc.Micross Components, Inc., a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications, is pleased to announce our exclusive partnership with Sital Technology (sitaltech.com), the leader in MIL-STD-1553 IP cores, specializing in integrated FPGA solutions.
Real Time with… IPC APEX EXPO 2024: Innovative Lamination Technology
05/07/2024 | Real Time with...IPC APEX EXPOKevin Barrett of Insulectro and Victor Lazaro of Indubond discuss their companies' partnership, focusing on Indubond's innovative lamination technology that uses induction heating. They discuss the advantages of this technology over traditional methods, its benefits to customers, and the crucial role of automation in manufacturing.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
IDTechEx Discusses Low-Loss Materials: The Enabler of Future Connected Vehicles?
05/06/2024 | IDTechExFuture connected vehicles will offer future drivers a safer, smoother, and more convenient driving experience. Not only will drivers get access to more navigation and entertainment options, but they will also gain access to safety technologies that will potentially reduce accidents, improve congestion, and reduce emissions globally by allowing vehicle safety systems to communicate with each other and with city traffic infrastructure.
BrainChip, Frontgrade Gaisler to Augment Space-Grade Microprocessors with AI Capabilities
05/06/2024 | BUSINESS WIREBrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, and Frontgrade Gaisler, a leading provider of space-grade system-on-chip solutions, announce their collaboration to explore the integration of BrainChip’s AkidaTM neuromorphic processor into Frontgrade Gaisler’s next generation fault-tolerant, radiation-hardened microprocessors.