Global Foldable Phones Market to See CAGR of 24.6% from 2019 to 2025
May 14, 2019 | Globe NewswireEstimated reading time: 1 minute
The global foldable phones market is expected to witness a CAGR of 24.6% from 2019 to 2025. Advent of nascent technology attracting the target demographic is expected to drive the market growth over the forecast period. Moreover, advantages over existing technologies in the market will propel the market growth in the coming years.
Foldable phones are at the forefront of smartphone technology set to be commercialized in the year 2019. Combining the attributes of a large-screen tab with the portability of smartphones is expected to attract the customer base. New entrants, such as Samsung and Huawei will set the trend of this new technology and solidify their position in the market. Major players are anticipated to enter the market by the year 2020. Foldable phones have high cost; therefore, an economic version is likely to flood the market in the coming years. Additionally, new folding technology is also anticipated to enter the market over the forecast period, for instance, Apple, Inc. has patented its folding phone with a hinge heating technology to protect it from damage incurred in use overtime.
Outwards Segment: the Fastest CAGR from 2019 to 2025
Based on folding technology, outwards segment is anticipated to register the fastest CAGR from 2019 to 2025. This can be attributed to the wedge problem faced in the inward folding smartphones. Smartphone with inward folding screen, such as the Samsung Galaxy Fold experiences a wedge formation in the middle of the screen. However, the outwards folding smartphones, for instance, the Huawei Mate X folds outwards generate less pressure on the screen. This results in minimal curve formation on the screen.
Foldable Phones - Regional insight
Asia-Pacific is expected to hold the largest share of the market over the forecast period. Rise in per capita income of the target demographic of this region is anticipated to drive the market growth in the coming years. Moreover, decrease in the cost of these devices due to presence of ubiquitous electronics manufacturing units in this region is expected to drive the market growth over the forecast period. Additionally, presence of key players in this region is expected to give impetus to the market growth from 2019-2025.
Suggested Items
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
Bell to Build X-Plane for Phase 2 of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program
07/09/2025 | Bell Textron Inc.Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 2 of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program with the objective to complete design, construction, ground testing and certification of an X-plane demonstrator.
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.