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May 2019 Issue of PCB007 Magazine Available Now
May 15, 2019 | I-Connect007Estimated reading time: Less than a minute
How do current materials stack up? In the May 2019 issue of PCB007 Magazine, we find out. First, we lay down some high-level perspective on materials, megatrends in materials, and economic forces at play in the market. Then, we layer in specifics with materials manufacturers in this issue.
This month’s issue of PCB007 Magazine is now on the virtual newsstand, and available for delivery in your e-mailbox each month. Subscribe through your my I-Connect007 membership.
Suggested Items
Spirit Announces Sale of FMI to Tex Tech Industries
01/14/2025 | Spirit AeroSystems Holdings, Inc.Spirit AeroSystems Holdings, Inc. announced the sale of Fiber Materials Inc (FMI) business based in Biddeford, Maine, and Woonsocket, Rhode Island, to Tex Tech Industries, Inc. (Tex-Tech) for $165 million in cash.
Imec Achieves Breakthrough in Silicon Photonics
01/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, has announced a significant milestone in silicon photonics with the successful demonstration of electrically-driven GaAs-based multi-quantum-well nano-ridge laser diodes fully, monolithically fabricated on 300 mm silicon wafers in its CMOS pilot prototyping line.
SolderKing to Highlight Innovations in Soldering and Manufacturing Efficiency at Southern Manufacturing & Electronics 2025
01/08/2025 | SolderKing Assembly Materials Ltd,SolderKing, a leading UK manufacturer of advanced soldering materials and consumables, will be exhibiting at the Southern Manufacturing and Electronics Show from 4-6 February 2025 at the Farnborough International Exhibition Centre, Stand J90.
SMTA Announces Wafer-Level Packaging Symposium Program
01/08/2025 | SMTAThe SMTA is excited to announce the technical program for the 2025 Wafer-Level Packaging Symposium. The symposium will be held February 18-20, 2025 at The Hyatt Regency San Francisco Airport in San Francisco, California.
MANA Develops Ferroelectric-ferromagnetic Materials for Next-generation Electronics
01/07/2025 | PRNewswireResearchers at the Research Center for Materials Nanoarchitectonics (MANA) have proposed a method to create ferroelectric-ferromagnetic materials, opening doors to advancing spintronics and memory devices.