BAE Systems' Joint Strike Fighter Underpins Advanced Manufacturing Growth in South Australia
May 21, 2019 | BAE SystemsEstimated reading time: 1 minute

BAE Systems Australia has celebrated the production of the 15,000th titanium part produced at Edinburgh Parks in South Australia for the world’s largest defence program, the F-35 Joint Strike Fighter.
The range of parts produced in Australia have delivered 500 tail sets which, together with the aft fuselage and horizontal tail sets, make up the rear section of each jet which BAE Systems produces across its global enterprise.
BAE Systems Australia supplies F-35 components to both its UK business and to Victorian manufacturer Marand.
Production of vertical tail parts at Edinburgh Parks will continue for another two decades, possibly further depending on global sales of the Joint Strike Fighter aircraft.
Securing decades of work on the global F-35 program has underpinned the company‘s investment in bespoke titanium machining facilities at Edinburgh Parks, which was also supported by the South Australian Government.
As well as manufacturing a range of products for the F-35 Joint Strike Fighter, the company also produces bespoke components for other critically important Defence programs including the Nulka decoy and the Evolved Sea Sparrow Missile.
BAE Systems Australia Managing Director Defence Delivery, Andrew Gresham said:
“Australia’s strength is in the ability of manufacturers to excel in the production of highly specialised products.
“We are undertaking very complex and advanced manufacturing in a way that is cost effective and globally competitive.
“Digitisation will be the next big step change to further improve our competitiveness by allowing us to collaborate seamlessly with our suppliers and partners in real time.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
India’s Aerospace and Defence Engineered for Power, Driven by Electronics
09/16/2025 | Gaurab Majumdar, Global Electronics AssociationWith a defence budget of $82.05 billion (2025–26) and a massive $223 billion earmarked for aerospace and defence spending over the next decade, India is rapidly positioning itself as a major player in the global defence and aerospace market.
VIDEOTON EAS's Bulgarian Subsidiary Expands Into Automotive Products
09/15/2025 | VideotonVEAS Bulgaria, engaged in electronics manufacturing, has joined the ranks of VIDEOTON companies authorized to produce automotive products.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
09/15/2025 | HanwhaHanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in