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Advanced Electronics Packaging Digest

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Dongguk University Develops Breakthrough Material for Next-Gen Smart Devices

03/13/2026 | PRNewswire
Next-generation optoelectronic systems (devices that convert light to electrical energy) leverage organic semiconductor-based indoor energy-autonomous architectures for cutting-edge applications.

Myrias Optics Secures $2.1M Seed Funding to Advance Wafer-Level Metaoptics

02/25/2026 | PRNewswire
Myrias Optics, a world leader in wafer-level metaoptics and diffractive optical technologies, announced the closing of a $2.1 million Seed 1 financing round in January 2026.

New IPC-6921 Standard Sets Requirements and Acceptance Criteria for Organic IC Substrates

01/23/2026 | Global Electronics Association
The Global Electronics Association has officially released IPC-6921, Requirements and Acceptance for Organic IC Substrates.

PCBAIR Unveils 8-Layer Glass Core PCB Manufacturing for Next-Gen AI & HPC

12/08/2025 | PRNewswire
PCBAIR announced the launch of its advanced 8-layer Glass Core PCB manufacturing capabilities, combining proprietary Through Glass Via (TGV) technology with multi-layer redistribution layers (RDL).

Saab Q3 2025 Results: Delivering Sustained Growth

10/28/2025 | Saab
Order bookings for the third quarter amounted to SEK 20,861m (21,173), with strong growth in medium-sized orders.
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