-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
ECWC15 Call For Papers—Bridging Technology Sharing Innovation
May 29, 2019 | HKPCAEstimated reading time: 1 minute
The 15th Electronic Circuits World Convention (ECWC15) is the most notable international PCB symposium held every three tears in different cities around the world. In the last 40 years, members of the World Electronics Circuit Council (WECC) have taken turns to host this conference.
HKPCA is honored to host ECWC15 in 2020. The conference is scheduled to begin in Hong Kong on November 30, 2020 and conclude at the international Electronics Circuit Exhibition (Shenzhen in Sputh China) on December 2, 2020. The ECWC teams hope to provide a valuable platform to encourage learnings amongst peers and provide the latest on global PCB demand, PCB manufacturing processes as well as technologies to enable them to better cope with the changing market dynamics for trends such as 5G, autonomous driving, smart world and much more. It also aims to promote the domestic PCB industry and economic activities in every country and region.
We welcome local and international papers and invite you to participate in this international event that occurs only every 3 years. Network and share your experiences with peers in the PCB and electronics manufacturing industry. For the submission of an abstract for ECWC15, please use our submission form: ECWE15 Abstract Submission Form.
Topics of interest or scope are in areas of Management and Technology.
Technology
- Design and Development Tools—Materials, Components and Traceability
- Manufacturing—Equipment, Technology, Process Development, Automation
- Quality, Test and Life Cycle Management
- PCB Processes—Chemical Technology, Mechanical Technology, Optical Technology
- Packaging Technology—System in Packaging, Wafer-Level Packaging, Panel-Level Packaging
- Surface Mounting, Assembly and Interconnection
- Energy Harvesting/Green Energy
- Application Specific Areas—Automotive Electronics and Electromobility, Industrial and Power Electronics, Aerospace and Defence, Medical Electronics, Consumer Electronics
- Advanced and Emerging Technologies—5G requirements on PCBs
- Smart Living Applications—E-Textiles/Smart Textiles—Printed Electronics/Printed Hybrid
Management
- Global Market Trends and Outlook—Supply Chain Management
- Environment, health and Safety—Business Models and Strategy
- Certification and Qualifications—Total Cost of Ownership and Overall Equipment Efficiency (OEE)
- Industry 4.0/Smart Manufacturing—Traceability/Blockchain
Consider submitting your paper to ECWE15 Abstract Submission Form and sharing your knowledge with your peers at this prestigious event.
The ECWC15 program committee will nominate the best abstract out of all submissions. After the submission of the final papers the winners of the Best Paper Awards will be determined. The awards ceremony will take place on December 2, 2020.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Missile Strike on Ukraine Hits Flex Facility
08/22/2025 | FlexOn the morning of August 21, 2025, our facility in Mukachevo, Ukraine, was damaged during a missile strike. Our emergency protocols were executed to ensure the full evacuation of the site.
TPCA Establishes Thailand PCB Academy in Bangkok
08/22/2025 | TPCAA distinguished delegation of distinguished guests from industry, government, academia, and research in Taiwan and Thailand, including representatives from the Ministry of Higher Education, Science, Research, and Innovation (MHESI), the Board of Investment of Thailand (BOI), and the Taipei Economic and Cultural Office in Thailand (TECO), as well as professors from several Thai universities and member companies, attended the historic occasion.
SINBON Celebrates Opening of New US Manufacturing Facility
08/21/2025 | PRNewswireLeading electronics system integrator SINBON Electronics Co., Ltd. held an opening ceremony on August 18 to celebrate its new 59,000-square-foot facility in Clayton, Ohio.
PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
Nano Silver Inks Market Forecast Report 2025-2030
08/20/2025 | Globe NewswireThe Nano Silver Inks Market is expected to grow from USD 427.415 million in 2025 to USD 836.160 million in 2030, at a CAGR of 14.36%.