Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
It’s Only Common Sense: Your Biggest Competitor Is Complacency
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
Nano Dimension and Harris Receive Grant for ISS Project
May 31, 2019 | Nano DimensionEstimated reading time: 2 minutes
Nano Dimension Ltd. has received a grant approval from the Israel Innovation Authority, for developing hardware, in cooperation with Harris Corporation, that will fly on the International Space Station (ISS) and communicate with Harris’ ground based satellite tracking station in Florida. This project will provide a systematic analysis of 3D printed materials for radio frequency (RF) space systems, especially for Nano-satellites.
The total approved budget for the Israeli portion of this project is approximately $416,000 (NIS 1,500,000), of which the Israel Innovation Authority will finance 40%. According to the terms of the grant, Nano Dimension will pay royalties on future sales up to the full grant amount.
This unique project is being conducted in collaboration with Harris Corporation, a leading technology innovator that provides solutions that connect, inform and protect its clients. The Harris portion of the project is sponsored by a grant from Space Florida. During this one-year project, both companies will optimize the designs of the 3D printing process and RF components and prepare a system for the flight studies at the ISS.
Nano Dimension awarded Space Florida Grant by Governor of Florida Ron DeSantis, and the Israel Innovation Authority
This project has been selected by the Center for the Advancement of Science in Space, the manager of the ISS U.S. National Laboratory, to fly the space flight experiment on the ISS, using the team’s 3D printed materials and circuits. In this project, the companies will pioneer the first of a kind space flight experiment, that will fly in space at low earth orbit for one year on the ISS, helping to understanding how 3D printed circuits, systems, and materials will endure in various space environments.
This project will demonstrate innovative methods for manufacturing new RF systems. Until now, manufacturing of RF systems has remained static for the last 30 years with each circuit in its own “gold box/boxes” interconnected with cables and connectors. With 3D printing, the industry can explore a new manufacturing paradigm, that eliminates manual labor and streamlines production. Another benefit to this technology is a reduction/elimination of wasted material, making it a “green” process.
About Harris Corporation
Harris Corporation is a leading technology innovator, solving customers’ toughest mission-critical challenges by providing solutions that connect, inform and protect. Harris supports government and commercial customers in more than 100 countries and has approximately $6 billion in annual revenue. The company is organized into three business segments: Communication Systems, Space and Intelligence Systems and Electronic Systems.
About Nano Dimension Ltd
Nano Dimension is a leading electronics provider that is disrupting, reshaping, and defining the future of how cognitive connected products are made. With its unique 3D printing technologies, Nano Dimension is targeting the growing demand for electronic devices that require increasingly sophisticated features. Demand for circuitry, including PCBs - which are the heart of every electronic device - covers a diverse range of industries, including consumer electronics, medical devices, defense, aerospace, automotive, IoT and telecom. These sectors can all benefit greatly from Nano Dimension’s products and services for rapid prototyping and short-run manufacturing.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
PCBAA Names Industry Veteran Dan Weber to Board of Directors
10/31/2025 | PCBAAThe Printed Circuit Board Association of America has added Dan Weber, Executive Vice President and General Counsel at TTM Technologies, to the PCBAA board of directors.
KLA Reports Fiscal Q1 2026 Results
10/31/2025 | PRNewswireKLA Corporation announced financial and operating results for its first quarter of fiscal year 2026, which ended on Sept. 30, 2025, and reported GAAP net income of $1.12 billion and GAAP net income per diluted share of $8.47 on revenues of $3.21 billion.
Samsung Teams With NVIDIA to Lead the Transformation of Global Intelligent Manufacturing Through New AI Megafactory
10/31/2025 | SamsungSamsung Electronics today announced plans to create a new AI Megafactory in collaboration with NVIDIA, marking a major milestone in the company’s efforts to lead the global paradigm shift toward AI-driven manufacturing.
Fresh PCB Concepts: Resilience and Renewal in Domestic PCB Manufacturing
10/30/2025 | Team NCAB -- Column: Fresh PCB ConceptsAs veterans of PCB manufacturing, we have spent much of our careers walking factory floors, examining copper circuits under microscopes, and troubleshooting plating lines when they go awry at 2 a.m. We can say with confidence that PCBs are the unsung heroes of modern life. They’re in everything, from toothbrushes and thermostats to satellites and defense systems.