Global Sourcing Spotlight: How Global Sourcing Drives Innovation
One World, One Industry: IPC APEX EXPO 2025 Marks a Special Anniversary Year
Nolan’s Notes: Your Golden Ticket
Help Build the Industry’s Future: Become an IPC Emerging Engineer or Mentor
June 25, 2019 | IPCEstimated reading time: 1 minute
IPC’s Emerging Engineer program provides professionals early in their careers an opportunity to learn from industry mentors about IPC Standards development, and to obtain education and training for professional development. IPC is now actively seeking applications for engineers and mentors for the 2020 Emerging Engineer program.
To be eligible to participate as an Emerging Engineer, professionals must have worked in the industry for less than 5 years or be a university student. Mentors must have worked in the industry for a minimum of 7 years and on an IPC committee for at least five years.
Emerging Engineers Receive:
- Education and mentoring for professional development
- Recognition for the program participant and his/her company—industry awareness
- Complimentary All-Access Package registration to IPC APEX EXPO, for three years (attendance required)
- Complimentary registration to IPC SummerCom featuring Panelpalooza (attendance not required)
- Limited number of University Student Emerging Engineers are eligible to receive reimbursement for travel, room, and incidentals.
Mentors Receive:
- Experiences and connections for career enrichment
- Opportunity to demonstrate leadership skills and technical expertise
- Recognition for program participant and his/her company—industry awareness
- Registration to recognition luncheons
“The IPC Emerging Engineer program gives new engineers a leg up early in their careers,” said John Mitchell, IPC president and CEO. “And it enables industry experts a chance to share their knowledge and expertise with the next generation of engineers. We’re all working together to make our industry stronger.”
IPC is now accepting applications for the 2020 Emerging Engineer program and a limited number of university student positions are available. For more information, visit www.ipc.org/emerging-engineer. To submit an application, send an e-mail to careerdevelopment@ipc.org. Deadline for applications is November 15, 2019.
Share on:
Suggested Items
Intel Appoints Lip-Bu Tan as Chief Executive Officer
03/13/2025 | Intel CorporationIntel Corporation announced that its board of directors has appointed Lip-Bu Tan, an accomplished technology leader with deep semiconductor industry experience, as chief executive officer, effective March 18.
IMAPS and DPC: 21 Years of Elevating Technical Knowledge
03/13/2025 | Marcy LaRont, I-Connect007The IMAPS 21st Device Packaging Conference (DPC) may have taken place at a conference center located down an idyllic desert road showcasing the best of what native Arizona has to offer, but the topics at this conference were anything but laid-back. This important platform for professionals in microelectronics and advanced packaging set the stage for a technology in high demand. Brian Schieman, IMAPS executive director, says the show was organized to demonstrate their commitment to addressing current technological trends and with significant energy directed toward fostering connections within the supply chain.
KYZEN Announces the Retirement of Longtime Executive Vice President Tom Forsythe
03/13/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, announces the retirement of Tom Forsythe, Executive Vice President, effective December 31, 2024, after more than three decades of service to the company and the electronics manufacturing industry.
Technica USA Celebrates 40 Years of Excellence in Electronics Manufacturing
03/13/2025 | Technica USATechnica USA, a leading provider of materials, equipment, installation, and services for the printed circuit board (PCB) fabrication, PCB Assembly, substrates, MEMS, and semiconductor industries, proudly announces its 40th anniversary in 2025.
INEMI Launches Study of AOI Inspection for Fine Pitch Substrates Seeking Industry Participation
03/11/2025 | iNEMIThe fine lines and spaces of increasingly popular heterogeneous SiP packages, coupled with larger panel sizes and more substrate layers, demand increased capabilities from automated optical inspection (AOI) equipment to accurately detect, characterize and reject true defects without over-rejections.