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Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication

10/15/2025 | I-Connect007
I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.

Nolan’s Notes: Tariffs, Technologies, and Optimization

10/01/2025 | Nolan Johnson -- Column: Nolan's Notes
Last month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.

MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation

09/30/2025 | MacDermid Alpha & Graphic PLC
MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Graphic PLC, a Somacis company, with the installation of the first horizontal electroless copper metallization process in the UK.

Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032

09/18/2025 | Globe Newswire
The global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.

MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025

09/18/2025 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
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