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Flex, Teradyne Robotics Expand Partnership for Global Smart Manufacturing Automation

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Flex and Teradyne Robotics are expanding their collaboration to accelerate intelligent automation across global manufacturing.

OE‑A Publishes 10th Edition of the Roadmap for Flexible and Printed Electronics

04/22/2026 | OE-A
With the publication of the 10th edition of the “OE-A Roadmap for Flexible and Printed Electronics,” the OE-A, an international working group for printed electronics within the VDMA, once again presents the central guidance and reference document for the industry.

Standardization, Workforce, and the Road Ahead for Flex–Packaging Integration, Part 3

04/22/2026 | Anaya Vardya, American Standard Circuits
Parts 1 and 2 of this series established the technical foundation and application landscape for the convergence of flexible PCBs and advanced semiconductor packaging. Part 3 addresses what comes next: the standards frameworks, talent pipelines, and strategic imperatives that will determine whether the industry can scale this convergence reliably and competitively.

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04/16/2026 | Anaya Vardya, American Standard Circuits
In the second of this two-part series, Anaya Vardya of American Standard Circuits examines applications, challenges, manufacturing considerations, and future trends emerging from the convergence of flexible printed circuit boards and advanced semiconductor packaging. Applications driving the convergence include consumer electronics, automotive systems, medical, wearables, aerospace and more.
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