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Lenthor Engineering Approved by Lockheed
July 17, 2019 | Lenthor EngineeringEstimated reading time: Less than a minute
Lenthor Engineering, a California-based designer, manufacturer and assembler of flex and rigid-flex printed circuit boards (PCBs), has recently gained approval for their 53,000 sqft advanced flex and rigid-flex fabrication and assembly facility by Lockheed Martin Corp. (LMCO).
With this approval, Lenthor will be able to support both LMCO directly and all of their sub-contractors in the fulfillment of their high-priority defense contracts.
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Brent Fischthal - Koh YoungSuggested Items
Flex, Teradyne Robotics Expand Partnership for Global Smart Manufacturing Automation
04/22/2026 | PRNewswireFlex and Teradyne Robotics are expanding their collaboration to accelerate intelligent automation across global manufacturing.
OE‑A Publishes 10th Edition of the Roadmap for Flexible and Printed Electronics
04/22/2026 | OE-AWith the publication of the 10th edition of the “OE-A Roadmap for Flexible and Printed Electronics,” the OE-A, an international working group for printed electronics within the VDMA, once again presents the central guidance and reference document for the industry.
Standardization, Workforce, and the Road Ahead for Flex–Packaging Integration, Part 3
04/22/2026 | Anaya Vardya, American Standard CircuitsParts 1 and 2 of this series established the technical foundation and application landscape for the convergence of flexible PCBs and advanced semiconductor packaging. Part 3 addresses what comes next: the standards frameworks, talent pipelines, and strategic imperatives that will determine whether the industry can scale this convergence reliably and competitively.
Boeing, Millennium Scale Space Production to Meet Growing Demand
04/20/2026 | BoeingBoeing and its subsidiary Millennium Space Systems are expanding space production capacity and broadening their satellite portfolio to help government and commercial customers field capability faster and with greater flexibility.
Applications, Challenges, and the Future of Flex–Packaging Integration, Part 2
04/16/2026 | Anaya Vardya, American Standard CircuitsIn the second of this two-part series, Anaya Vardya of American Standard Circuits examines applications, challenges, manufacturing considerations, and future trends emerging from the convergence of flexible printed circuit boards and advanced semiconductor packaging. Applications driving the convergence include consumer electronics, automotive systems, medical, wearables, aerospace and more.