Goepel electronic Adds Solder Paste and Placement Inspection

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Goepel electronic has enhanced the capabilities of its 3D AOI systems Basic Line · 3D and Vario Line · 3D with the addition of complete solder paste inspection function as well as placement control before the soldering process—making the system more flexible. In addition to the classic AOI tests, these systems can now also be used for inspection tasks to check paste volume, paste height, offset and short circuits.

A large number of EMS service providers are specialists in the high-mix/low-volume segment. Quality assurance of the manufactured products is the top priority and, in addition to flexibility in production, a significant competitive advantage. In order to be able to produce these small and medium quantities economically, the universal use of production machines and inspection systems as well as the early detection of possible defects is an indispensable requirement. In addition to their regular use after soldering the assemblies, AOI systems can also carry out a placement check before soldering if desired, e.g. to detect incorrect components or reverse polarity in advance. This reduces high repair costs or costs due to rejects of faulty assemblies.

Goepel electronic’s 3D AOI systems can perform all 3D inspection functions and solder paste inspection in the inline process with the Vario Line · 3D, as well as stand-alone with manual loading in the Basic Line · 3D. Cost advantages arise in particular when the inline 3D system is combined as an island solution with magazining stations for loading and unloading. Depending on requirements, it can then be used for one or the other application. An additional initial sample inspection or placement inspection can then turn the Vario Line · 3D into a genuine all-in-one system.