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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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AT&S to Expand IC Substrate Production in Chongqing
July 29, 2019 | XinhuaEstimated reading time: Less than a minute
AT&S, one of the leading global manufacturers of high-end printed circuit boards (PCB), continues to expand capacities by pumping nearly €1 billion into building a new plant in southwest China's Chongqing Municipality, according to a Xinhua report.
The new plant, producing integrated circuit (IC) substrates for high-performance computing modules, is intended to be built at the existing production site in the city. AT&S inked an agreement last Thursday with the administration committee of Chongqing's Liangjiang New Area on the new investment. Construction work begins immediately and the start of production is planned for the end of 2021.
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