-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
TTM Technologies Unveils Executive Transition
August 22, 2019 | Globe NewswireEstimated reading time: 1 minute
TTM Technologies, Inc. has announced that Catherine Gridley will be joining the TTM executive team on September 3 as incoming senior vice president and president of the aerospace and defense/specialty (A&D) business unit (BU), and will formally assume the A&D leadership role on January 1, 2020.
Cathie joins TTM most recently from Northrup Grumman Corporation (NGC) where she was the vice president and general manager of their advanced defense services division leading more than 5,000 employees worldwide. Prior to her time at NGC, she held P&L leadership positions with DynCorp International, GE Aviation Systems and Goodrich. Cathie earned her Bachelor of Science in Accounting from Ithaca College and Masters in Business Administration from Binghamton University.
Phil Titterton, currently TTM’s executive vice president and president of the A&D BU will transition to executive vice president and chief operating officer (COO). He will be assuming this responsibility on January 1st, 2020. Brian Barber, currently executive vice president and COO will transition to an advisory role on January 1st, 2020, reporting to Tom Edman with plans to retire on August 31st, 2020.
Tom Edman, CEO of TTM, commented, “I am excited to welcome Cathie to the TTM team. Her depth and breadth of experience will be a tremendous asset to TTM’s solid position as a key supplier to the A&D electronics industry. Cathie’s hiring puts TTM in a position to further advance our engineering and manufacturing capabilities in support of our customers."
“I am grateful for Brian’s service to TTM and its predecessor companies over the past 20 years, as he has driven a culture of continuous improvement and operational excellence throughout our 29 manufacturing facilities. I am confident that Phil will ably build on this legacy in driving optimal performance on behalf of our customers,” Edman further commented.
About TTM
TTM Technologies, Inc. is a leading global printed circuit board manufacturer, focusing on quick-turn and technologically advanced PCBs, backplane assemblies and electro-mechanical solutions as well as a global designer and manufacturer of RF and microwave components and assemblies. TTM stands for time-to-market, representing how TTM's time-critical, one-stop manufacturing services enable customers to shorten the time required to develop new products and bring them to market. Additional information can be found at www.ttm.com.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Federal Electronics Elevates Hermosillo Facility with Advanced Mycronic 3D AOI System
08/12/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has enhanced its new production line at its Hermosillo, Mexico facility with the addition of the Mycronic MYPro i50 Automated Optical Inspection (AOI) system.
Insulectro and Electroninks Sign North American Distribution Agreement
08/12/2025 | InsulectroElectroninks, a leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced a strategic collaboration and distribution partnership with Insulectro, a premier distributor of materials used in printed electronics and advanced interconnect manufacturing.
Jeh Aerospace Raises $11M to Boost Aircraft Supply Chain
08/12/2025 | I-Connect007 Editorial TeamJeh Aerospace, the high-precision aerospace and defense manufacturing startup founded by Vishal Sanghavi and Venkatesh Mudragalla, has raised $11 million in a Series A round led by Elevation Capital, with support from General Catalyst, to scale its commercial aircraft supply chain manufacturing in India, according to OEM.
Sypris Reports Second Quarter Results
08/12/2025 | BUSINESS WIREThe Company’s second quarter revenue decreased compared to the prior-year quarter primarily due to the near-term impact of tariffs, which reduced demand from certain transportation-related customers and necessitated the conversion of certain shipments from our facility in Mexico to a value-add only sub-maquiladora.
Koh Young Highlighting Dimensional Metrology & Inspection Solutions at the Binghamton University Electronics Packaging Symposium
08/12/2025 | Koh YoungKoh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, is proud to announce its sponsorship and participation in the 36th Annual Electronics Packaging Symposium (EPS), hosted at the GE Aerospace Research Campus in Niskayuna, New York, on September 03-04, 2025.