Infrastructure Ready or Not, Companies are Shipping 5G Phones to Spur Sales
September 5, 2019 | TechSearch International, Inc.Estimated reading time: 1 minute
Many smartphone manufacturers are offering 5G handsets in a bid to increase mobile phone sales. Several 5G-compatible smartphones are in mass production and more are scheduled for release this year.
Smartphones sales have stagnated so OEMs and carriers are pushing 5G development and deployment with the hopes that customers will be enticed to upgrade their phones.
These early 5G phones are primarily designed to enhance 4G LTE by adding sub-6GHz frequency spectrum. Support for the millimeter-wave (mmWave) version of 5G, which many consider to be the “true” 5G, is limited as rollout of the technology is still in its infancy.
By examining the design and construction of several 5G smartphones, TechSearch International has spotted important trends for the packaging industry, including more chips and packages in 5G handsets than 4G phones. For example, the Samsung Galaxy S10 5G has almost 2x more packages than the S10/S10+ for the RF front-end and baseband functions, and that is just to support sub-6GHz 5G connectivity. Additional RFFE packages are required for mmWave 5G.
TechSearch International’s latest Advanced Packaging Update provides details about RFFE designs and packages, transceiver and modem comparisons, and additional antenna and PMIC requirements for 5G handsets.
The latest Advanced Packaging Update also discusses packages found in basic feature phones.
About TechSearch International, Inc.
TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 18,000 contacts in North America, Asia, and Europe.
Suggested Items
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Standard Of Excellence: The Products of the Future
09/19/2023 | Anaya Vardya -- Column: Standard of ExcellenceIn my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering
09/18/2023 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
09/18/2023 | IntelIntel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.