Dan’s Biz Bookshelf ‘House of Huawei'
Happy’s Tech Talk #41: Sustainability and Circularity for Electronics Manufacturing
Facing the Future: Challenges and Opportunities in Reshoring PCB Manufacturing
IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2020
September 10, 2019 | IPCEstimated reading time: 1 minute
IPC — Association Connecting Electronics Industries invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 5, 2020, and will be displayed throughout the event, offering additional visibility.
Technical poster presentations are being sought on all relevant electronics topics, including design, materials, assembly, processes and equipment and test, especially:
- 3D Printing in Electronics Manufacturing
- Automation in Electronics Manufacturing
- Adhesives
- Advanced Technology
- Area Array/Flip Chip/0201 Metric
- Assembly and Rework Processes
- BGA/CSP Packaging
- Black Pad and Other Board Related Defect
Issues
- BTC/QFN/LGA/MLF Components
- Business & Supply Chain Issues
- Cleaning
- Conformal Coatings
- Corrosion
- Counterfeit Electronics
- Design
- Electromigration
- Electronics Manufacturing Services
- Embedded Passive & Active Devices
- Environmental Compliance
- Graphene in Electronics Manufacturing
- Lean Six Sigma
- LED Manufacturing
- Failure Analysis
- Flexible Circuitry
- HDI Technologies
- Head-on-Pillow
- Board and Component Warpage
- High Speed, High Frequency & Signal
Integrity
- Industry 4.0
- Lead-Free Fabrication, Assembly &
Reliability
- Miniaturization
- Nanotechnology
- Optoelectronics
- Packaging & Components
- PCB Fabrication
- PCB and Component Storage & Handling
Performance
- Quality & Reliability
- Photovoltaics
- PoP (Package-on-Package)
- Printed Electronics
- Reshoring
- RFID Circuitry
- Robotics
- Soldering
- Surface Finishes
- Test, Inspection & AOI
- Tin Whiskers
- 2.5-D/3-D Component Packaging
- Underfills
- Via Plugging & Other Protection
- Wearables
An abstract of up to 300 words summarizing technical and previously unpublished work covering case histories, research and discoveries should be submitted by Friday, November 15, 2019, click here.
For more information about poster participation or other opportunities to participate in IPC APEX EXPO, contact Toya Richardson, IPC technical programs coordinator, at ToyaRichardson@ipc.org. or Brook Sandy-Smith, IPC technical education program manager, at BrookSandy@ipc.org
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,500 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Hall of Fame Spotlight Series: Highlighting Jerry Siegmund
08/15/2025 | Dan Feinberg, I-Connect007The Raymond E. Pritchard Hall of Fame (HOF) Award has been awarded to those who have contributed significantly to the Global Electronics Association (formerly known as IPC) and our industry. Though many early HOF members have passed away and are unknown to today’s membership, their contributions still resonate. This special series on Hall of Fame members provides a reminder of who was honored and why.
MacDermid Alpha Electronics Solutions Announces New Strategy Vice President Role for India
08/14/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is pleased to announce the appointment of Dr. Ravi Bhatkal to the newly created role of Vice President, Strategy, India.
20 Years of Center Nanoelectronic Technologies (CNT) – Backbone of German Semiconductor Research Celebrates Anniversary
08/14/2025 | Fraunhofer IPMSThe Center Nanoelectronic Technologies (CNT) of the Fraunhofer Institute for Photonic Microsystems (IPMS) is celebrating its 20th anniversary this year. Since its founding in 2005, it has developed into a pillar of applied semiconductor research in Germany and Europe. With its unique research cleanroom and equipment adhering to the 300-mm wafer industry standard, CNT is unparalleled in Germany and serves as a central innovation driver for the microelectronics industry.
ASMPT, SMarTsol Technologies Inaugurate the Advanced Competence Center in Guadalajara
08/14/2025 | ASMPTASMPT, a global leader in solutions for the electronics industry, together with SMarTsol Technologies, officially inaugurated the Advanced Competence Center in Guadalajara.
Dupont De Nemours, Qnity Electronics Announce Pricing of Senior Secured Notes and Senior Notes
08/13/2025 | PRNewswireDuPont de Nemours, Inc. and Qnity Electronics, Inc. announced that Qnity priced an offering of $1.0 billion aggregate principal amount of 5.750% senior secured notes due 2032 and $750.0 million aggregate principal amount of 6.250% senior notes due 2033.