The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Insertion Loss Performance Differences Due to Plated Finish and Circuit Structure
October 2, 2019 | John Coonrod, Rogers CorporationEstimated reading time: 1 minute
Abstract
Many different final plated finishes are used in the PCB industry, each with its own influence on insertion loss. The impact of an applied finish on insertion loss generally depends on frequency, circuit thickness, and design configuration. This article will evaluate the effects of final plated finishes on the insertion loss of two popular high-frequency circuit design configurations: microstrip transmission-line circuits and grounded coplanar-waveguide (GCPW) transmission-line circuits.
Data will be presented for loss versus frequency for six different plated finishes commonly used in the PCB industry, and opinions will be offered as to why the loss behavior differs for the different plated finishes and for the different circuit configurations. Because the insertion loss of high-frequency circuits also depends on substrate thickness, circuits fabricated on substrates with different thicknesses will be evaluated to analyze the effects of substrate thickness on insertion loss using different plated thicknesses.
This article will also explore many different aspects of the final plated finishes on PCB performance. The nickel thickness in electroless nickel immersion gold (ENIG) finishes normally has some variations; data will show the effects of these variations on the RF performance of a PCB. Immersion tin is often used to minimize thickness variations and analysis will show the effects on RF performance for different thicknesses of immersion tin. The effects of plated finish on PCB performance can vary widely over frequency, and those effects will be shown for a wide range of frequencies from 1 to 100 GHz.
Insertion Loss Overview
The insertion loss of a high-frequency PCB circuit can decrease the usable signal levels of a system, whether in a receiver or a transmitter. Details on insertion loss can be found in a previous IPC paper, although a simple review of insertion loss might be helpful before examining the data on PCB final plated finishes. The total insertion loss is comprised of four loss components.
To read the rest of this article, which appeared in the September 2019 issue of Design007 Magazine, click here.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.