Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Dan’s Biz Bookshelf: ‘Believe in Better'
iNEMI’s PCBA Cleanliness End-of-Project Webinar Two Sessions Scheduled
October 3, 2019 | iNEMIEstimated reading time: Less than a minute
Join iNEMI to review the findings of PCBA Cleanliness project, which looked at the impact of cleanliness on PCBAs with bottom-terminated components (BTCs), with particular focus on ionic contamination levels. Using single-row QFN component packages as a representative example of a BTC, the team utilized clean and no-clean solder pastes and conducted various levels of cleaning (no-clean, water clean and solvent clean). They then conducted testing using methods such as SIR and ion chromatography in an effort to understand functional performance when residues are present underneath these packages.
Join the PCBA Cleanliness end-of-project webinar to review the results of this study. Two sessions are scheduled (October 7 & 8). The webinar is open to members and non-members; registration is required.
EMEA & Americas Session
PLEASE NOTE: This session re-scheduled from October 8
Monday, October 7, 2019
11:00 a.m. — noon EDT (US) / 5:00-6:00 p.m. CEST (Europe)
Register now
APAC Session
Tuesday, October 8, 2019
10:00-11:00 a.m. JST (Japan) / 9:00-10:00 a.m. CST (China)
Register now
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.