Dan’s Biz Bookshelf: ‘The Next RenAIssance: AI and the Expansion of Human Potential’
The Chemical Connection: When the Industry Moves Faster Than the Standards
Driving Innovation: Selecting the Right Laser Source
Conductor Analysis Technologies Ships Second Generation OM Thermal Stress System
October 3, 2019 | Conductor Analysis TechnologiesEstimated reading time: Less than a minute
Conductor Analysis Technologies announces the shipment of a second generation OM Thermal Stress System to Robisan Laboratory located in Indianapolis, Indiana. This system builds on the earlier version developed more than 8 years ago with updated technology which performs reflow simulation fully compliant with IPC TM-650 Method 2.6.27.
According to Lance Auer, Engineering Fellow at CAT, the system will be widely available to the printed circuit industry since there is no large price tag associated with its acquisition. It is available on a lease/cost-per-cycle basis to circuit board manufacturers and for sale to qualified OEMs.
About Conductor Analysis Technologies, Inc.
Conductor Analysis Technologies, Inc. is a provider of market-critical data utilized by designers, manufacturers, and users of printed circuit boards. Founded in 1994 our products and services provide a standardized, independent, and documented evaluation of printed circuit manufacturing capability, quality, and reliability.
About Robisan Laboratory, Inc.
Robisan Laboratory, Inc. is a fully accredited independent test and measurement laboratory serving the electronics industry. Our scope is focused on offering mechanical, electrical, and environmental testing, along with failure analysis.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Global Electronics Association and CalcuQuote, an Elisa Industriq Business, Launch Joint Supply Chain Intelligence Initiative
04/29/2026 | Global Electronics AssociationThe Global Electronics Association and CalcuQuote, Elisa Industriq today announced a partnership to deliver timely, actionable supply chain intelligence for the electronics industry.
Is China Plus One Still Happening in the PCB Industry?
04/28/2026 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.For much of the past five years, China Plus One has been shorthand for supply-chain diversification: reducing dependency on mainland China by adding manufacturing capacity elsewhere in Asia. In the PCB industry, however, in early 2026, it is more nuanced. It looks less like a clean geographic shift and more like a layered, capital-intensive rebalancing of global capacity, one that still leaves China deeply embedded at the center.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
Meet Emerging Engineer Dennis Donovan, Kratos Space Commercial
04/29/2026 | Michelle Te, I-Connect007Like many of today’s engineers, Dennis Donovan grew up interested in how things worked. He wanted to see what was inside and how to make it better. Now, he has three bachelor’s degrees, is earning his master’s, and works as an electrical engineering technologist. He aspires to work in PCB assembly with a particular focus on aerospace electronics. He’s a sharp, well-spoken young man with an eye on his future.
Call for Abstracts for Third Pan-European Electronics Design Conference
04/27/2026 | Global Electronics AssociationThe German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the Third Pan-European Electronics Design Conference (PEDC).