-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
AT&S and Chongqing University Collaborate on Research and Education
October 7, 2019 | AT&SEstimated reading time: 2 minutes
AT&S (Chongqing) Co., Ltd and the Chongqing University have signed a framework agreement of strategic cooperation on September 26. According to the agreement, both parties will collaborate on a range of academic and educational programs including internship programs targeting different majors, designed curriculums for the IC substrates industry, talents recruitment, joint R&D projects, continuing education cooperations and joint student exchange programs between Universities in Chongqing and in Austria. It represents a milestone for AT&S as a first high-end IC substrates manufacturer in China partnering with one of the universities affiliated to the Ministry of Education of China in research and education excellence.
Chen-Jiang Phua, CEO of AT&S Business Unit Mobile Devices and Substrates, commented: “The agreement represents a win-win partnership. AT&S will be able to leverage Chongqing University’s talented students and outstanding faculty for expertise in cutting-edge technologies. Chongqing University will benefit from AT&S’s long-standing R&D capabilities and its market and commercialization expertise as of one of the world’s leading HDI PCBs and IC substrates manufactures.”
According to Phua, AT&S (Chongqing) offers training ground on site for students from Chongqing University. In September, around 80 undergraduates with the major in Engineering & Applied Chemistry spent one week with AT&S and got practical exposure from experts of the company whom enriched their knowledge in the semiconductors related manufacturing industry. It is one of the ways for AT&S to help students to begin their careers as a professional and solve the talent shortage for this fast growing key industry.
“Chongqing University combines socio-economic vision, technological capabilities, and commitment to talent development in a very creative and rather unique way, and the cooperation is a reflection of our commitment to the intellectual and human potential of this distinguished institution. We are proud to be partnering with Chongqing University to pursue scientific leadership and research excellence. Our collaboration agreement lends strong support to the notion that Chongqing will become an international logistics hub and an engine of modern industrialization”, commented Andreas Gerstenmayer, CEO of AT&S.
Chongqing is an important production bases for AT&S worldwide. In this city, AT&S has established two state-of-the-art plants for fast growing semiconductor industry and advanced HDI since 2011. In July 2019, AT&S annouced to invest a further €1 billion Euros in Chongqing over the next five years on a new manufacturing facility for high-end IC substrates.
Chongqing University was founded in 1929. It is a key national university located in Chongqing. Among its various departments, Chongqing University is especially highly ranked in the Built Environment, Engineering, Technology and Business disciplines.
Suggested Items
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers
05/02/2024 | I-Connect007In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback.
The New Industry: Will the Growth Continue?
04/30/2024 | I-Connect007 Editorial TeamHow sustainable are the primary financial models in the United States regarding PCB fabrication shops? In this interview with economic experts Shawn DuBravac and Tom Kastner, we explore what’s happening with U.S. printed circuit board shops in today’s market, how consolidation affects the industry, and what can be done.
TTM’s High Tech Expansion and Industry Innovation
04/30/2024 | Marcy LaRont, PCB007 MagazineTom Edman has been the CEO of TTM Technologies since 2014 and has an extensive background in electronics and manufacturing. TTM is a leading global manufacturer of technology solutions, including mission systems, RF component and RF microwave microelectronics assemblies, and quick turn and advanced technology printed circuit boards.
U.S. Companies Invest Heavily in Robots
04/30/2024 | IFRManufacturing companies in the United States have invested heavily in more automation: total installations of industrial robots rose by 12% and reached 44,303 units in 2023. Number one adopter is the car industry followed by the electrical and electronics sector.