The Marketing Minute: A Brand Visibility Playbook—Get Seen, Heard, and Remembered
American Made Advocacy: Supporting the Entire PCB Ecosystem—Materials to OEMs
Marcy's Musings: The Hole Truth—Via Integrity in an HDI World
Amphenol Printed Circuits Recognizes Panasonic as a Qualified Vendor for Flexible Laminates
October 9, 2019 | Amphenol Printed CircuitsEstimated reading time: 1 minute
Amphenol Printed Circuits has qualified Panasonic’s Felios Flexible Laminates and will now increase usage on new part-numbers. Both Amphenol and Matrix have worked diligently to achieve this qualification milestone over the course of 2019.
Panasonic’s Felios is an advanced adhesive-less copper-clad flex circuit material, designed to meet the demanding high performance and reliability requirements of the Aerospace and Commercial Avionics market segments. Panasonic offers the largest selection of both thin and thick copper foil and polyimide film constructions in the industry.
“Panasonic and Matrix are an integral part of our planned growth in the Flexible Circuits business”, stated Christine Harrington, Managing Director, PCB Operations at Amphenol Printed Circuits. “Matrix is providing the best-in-class flexible materials. I would like to thank Matrix and Panasonic for their efforts to qualify and support Amphenol Printed Circuits”.
“Matrix is delighted to be one of Amphenol’s strategic partners, and our Team is committed to servicing the North American PCB marketplace with Felios, the most reliable and most dimensionally stable flexible circuit materials available”, says Jeff Cassell, vice president of Sales at Matrix.
About Matrix USA Inc.
Committed to the motto: “Quality Products, Dependable People”, Matrix was established in 1977 with the objective of providing quality raw material to the North American Printed Circuit Board Industry. Matrix has five Rapid Response warehouses located throughout the US and Canada that fulfill high quality, fast delivery, and custom orders daily. For further information visit: www.matrixusa.us.
About Amphenol Printed Circuits
Amphenol Printed Circuit (APC) is a world leader in the printed circuit industry for Military and Commercial markets, building PCBs, backplanes, flex and rigid-flex products to meet their customers’ demanding needs. APC’s capabilities are among the world’s broadest and most advanced, delivering consistent quality and reliability for demanding high-bandwidth systems and mission-critical applications for more than 30 years. For more information, visit www.amphenol-apc.com.
Share on:
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.