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SMTA Additive Electronics Conference: Industry Trends
October 10, 2019 | I-Connect007Estimated reading time: 1 minute
In her column, "Flex Talk: Additive Electronics: PCB Scale to IC Scale," Tara Dunn, Omni PCB president and conference co-chair, wrote, "The standard subtractive-etch process serves the industry well. Developments in materials, chemistry, and equipment enable the traditional PCB fabrication process to achieve feature sizes, such as line and space down to 30 microns. Larger shops with more sophisticated capabilities are building this technology today."
Tara continued, "Mainstream PCB manufacturing is often limited to 50-75 microns (mm) line and space. But the electronics industry is evolving quickly. Propelled by the demand for more sophisticated electronics, PCB design is being tasked with finer lines, thinner materials, and smaller via sizes. A traditional progression is to first move to HDI technology with microvias and multiple lamination cycles for fabrication. Today’s mSAP and SAP technology offers an advanced approach, with line and space capabilities of less than 25 microns, to meet these exceedingly complex design requirements." Tara will also be attending and moderating a panel discussion at the conference.
Don't miss out; start your research. Attend the SMTA Additive Electronics Conference on October 24, 2019, to launch your expertise in additive electronics.
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