Dan’s Biz Bookshelf: ‘Costovation: Innovation That Gives Your Customers Exactly What They Want—And Nothing More’
The Right Approach: ‘Twas the Night Before Christmas (Harley-style)
It’s Only Common Sense: Dear Santa, Here’s My Sales Wish List
Emerging Themes: Day 2 Coverage of productronica 2019
November 14, 2019 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Day two at productronica, and the themes emerge: 5G, high-speed, low-loss, and new formulations. These were the catchphrases of the materials suppliers. It is clear from all the conversations that designers and board specifiers need to learn all they can about the new materials emerging on the market.
The equipment makers are engaging in that same conversation with new capital equipment that either provides additional capabilities to support these new materials, or data collection and reporting via the Industry 4.0 protocols, or both. Wet process equipment continues to move toward the realization of the digital factory and the “lot size of one," with systems that adjust the parameters as needed, automatically.
CAM providers are chipping away at the work process walls that have traditionally existed between design and CAM, as well as knocking holes in the hand-off to fabrication to assembly. New software features and applications are aimed squarely at taking the drudgery out of the operation, finally letting the computers do what they do well.
Chemistry providers had news to share, as well. Atotech announced the addition-through-acquisition of the Via King graphite-based product to the portfolio. And not to be left out at all, solder mask and conformal coatings suppliers talked about environmental extreme protection, application accuracy, and efficiency.
It becomes very clear, after day two that the digitalization of the electronics manufacturing factory is the most effective path to increased profitability.
Enjoy the photos from Wednesday’s productronica show floor. We’ll continue to bring you quick coverage throughout the rest of the week from Messe München and the productronica exposition.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.