Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
It’s Only Common Sense: Your Biggest Competitor Is Complacency
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
Meet Industry Experts at the 2019 International Electronics Circuit Exhibition (Shenzhen)!
November 15, 2019 | HKPCAEstimated reading time: 1 minute
The International Technical Conference, to be held concurrently with the 2019 International Electronics Circuit Exhibition (Shenzhen) (formerly International Printed Circuit & APEX South China Fair), gives you valuable insights on the latest market trends to prepare you to face challenges and transform your business to a new level. Join us for the Conference at the Shenzhen Convention & Exhibition Center, China, 4-6 December 2019.
Stay on top with the industry leaders and experts
The 2019 Conference will feature international specialists and industry experts to address the hottest topics covering both market trend and technical updates of the industry. Here are some hot sessions that you can't miss!
- Keynote Speeches from Mr Canice Chung and Mr. You Lei, Chairmen HKPCA
- The Challenge and Opportunity of 5G High Frequency to PCB and PCBA, Mr. Liu Zhe Chief Engineer, ZTE Corporation
- Which Way is the PCB Industry Heading? Dr. Hayao Nakahara, President, N.T. Information Ltd.
- PCB Market Update, Dr. Shiuh-Kao Chiang, Managing Partner, Prismark
- IC Substrate Technology Characteristics Study, Mr. Lin Ting Hao, Sr. Project Director, Kinsus Interconnect Technology Corp.
- Challenges and Opportunity to PCB Material and Processing Technology from Automotive Electronics, Mr. James Tam, Project Manager, Robert Bosch Co., Ltd.
Get the latest show news at HKPCAshow.org.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
Better Sustainability Policies for Electronics
10/29/2025 | Diana Radovan, Global Electronics AssociationI joined the Global Electronics Association in August 2025 as the director of sustainability policy. Since then, much has happened in terms of geopolitics and in the development and re-envisioning of sustainability policies in the industry. While the European Commission has released several legislative packages to simplify sustainability requirements (“omnibus”), these developments haven’t yet settled and are not in effect. Given the many recent and ongoing public consultations, with often conflicting input from a broad range of stakeholders, final negotiations remain rather polarized among policymakers.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.
Come Together: Tom Marktscheffel Used Data to Build CFX and a Global Factory Standard
10/27/2025 | Sandy Gentry, Community MagazineWhen Tom Marktscheffel, director of product management software solutions at ASMPT, looks back on his nearly three decades in electronics manufacturing, one word stands out: data. “Data is the new gold,” he says. Without it, automation, artificial intelligence, and the factory of the future are impossible. With it, the industry can move from manual, error-prone processes to smart, connected systems that make real-time decisions.