Standard of Excellence: Turning Negative Customer Feedback Into Positive Outcomes
Smart Automation: The Growing Role of Additive Manufacturing
Global Citizenship: Redefining Connection and Responsibility in Digital Transformation
New Ultrasonic Coating System Advances Spray-On EMI Shielding Capabilities
January 14, 2020 | Sono-TekEstimated reading time: 1 minute
Sono-Tek Corporation (OTC BB: SOTK) announces the release of a new ultrasonic coating system, the FlexiCoat EMI, specifically designed for conformal spraying of EMI (Electromagnetic Interference) shielding material onto semiconductor packages. This new market is seeing growing interest and activity as a result of smaller devices requiring improved EMI shielding protection properties. Conventional techniques such as shield cans and SMT clips are inadequate for newer small devices. Ultrasonic coating is a cost-effective, faster and simpler alternative to expensive sputtering-based coating equipment.
Sono-Tek’s FlexiCoat EMI is an automated XYZ coating system specifically engineered and proven to spray copper and silver-filled shielding materials with precise control of coating characteristics and little overspray.
Sono-Tek ultrasonic nozzles are widely known for their low/no maintenance, non-clogging, high uniformity and highly repeatable performance. A special ultrasonic nozzle configuration was developed for these EMI applications to provide a more targeted spray area that reduces overspray drastically when compared with all other spray types. This new nozzle design is fully integrated into the FlexiCoat EMI system, along with an array of application-driven features to make the system a full coating solution for EMI shielding coatings.
Some features of the FlexiCoat EMI system include:
- 500x500 mm slides, conveyor and pumping system
- Proprietary ink mixing system to ensure ink stability over time
- UPH/throughput is significantly faster than sputtering at 1/10 the price
- Compatible with ink formulations from Tatsuta and other ink providers
- Uniform shielding coverage on top and sides of package is achieved using nozzle tilt
- Top surface: sidewall thickness ratio of 1: 0.6 ~ 0.7
Bennett Bruntil, Sono-Tek’s Vice President of Sales & Marketing, said: “Our entry into this growing semiconductor application was a natural outgrowth of our semiconductor coating expertise in other applications. Our equipment is quickly proving to be an excellent fit for companies looking for an effective, low-cost alternative to sputtering for deposition of new copper and silver-filled epoxy materials on the market.
Share on:
Suggested Items
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
04/03/2025 | Matt Stevenson -- Column: Connect the DotsI’ve been in this industry long enough to recognize red flags in PCB designs. When designers send over PCBs that look great on the computer screen but have hidden flaws, it can lead to manufacturing problems. I have seen this happen too often: manufacturing delays, yield losses, and designers asking, “Why didn’t anyone tell me sooner?” Here’s the thing: Minor design improvements can greatly impact manufacturing yield, and design oversights can lead to expensive bottlenecks. Here’s how to find the hidden flaws in a design and avoid disaster.
Real Time with... IPC APEX EXPO 2025: Tariffs and Supply Chains in U.S. Electronics Manufacturing
04/01/2025 | Real Time with...IPC APEX EXPOChris Mitchell, VP of Global Government Relations for IPC, discusses IPC's concerns about tariffs on copper and their impact on U.S. electronics manufacturing. He emphasizes the complexity of supply chains and the need for policymakers to understand their effects.