Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
It's Only Common Sense: The Evolution of Prospecting
Dan's Biz Bookshelf: 'Apple in China: The Capture of the World’s Greatest Company'
DuPont and SCHMID Announce Partnership for New PCB Plating Applications
February 4, 2020 | DuPontEstimated reading time: 1 minute
DuPont Electronics & Imaging and SCHMID Group today announce that they have entered into a nonexclusive joint development agreement to explore new PCB plating applications to bring advanced innovations to ther global customers. The partnership will benefit high-end printed circuit board manufacturers by delivering next-generation interconnect products and metallization processes that can create faster, smarter and more reliable devices for the 5G era. The new solutions which will include equipment and chemistry are expected to be launched in late 2020.
“SCHMID and DuPont’s combined expertise in equipment and chemistries positions us well for the needs for innovations in areas such as 5G, automotive and artificial intelligence,” said Avi Avula, Global Business Director, Interconnect Solutions, DuPont Electronics & Imaging. “SCHMID is an outstanding partner with extensive engineering expertise, process knowledge and world-class metallization equipment. Coupled with DuPont’s broad offerings including metallization chemistry, flexible copper clad laminates and dry film imaging films, strong customer relationships and global footprint, this partnership will enable us to advance metallization solutions for leading-edge PCB and substrate applications.”
“Partnering with DuPont will allow us to introduce disruptive innovations to our customers in the advanced electronics manufacturing market,” said Christian Schmid, President & CEO of SCHMID Group. “We are committed to launching advanced metallization systems that will address the challenges that our customers face to meet the required performance and reliability. We are confident that the possibilities enabled with this partnership will significantly contribute to realization of our joint target – delivering better solutions to create superior value.”
The new equipment and chemistry solutions are expected to address the challenges from advanced circuit board designs that require enhanced performance and reliability, and improved cost of ownership for production.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.
How Good Design Enables Sustainable PCBs
08/21/2025 | Gerry Partida, Summit InterconnectSustainability has become a key focus for PCB companies seeking to reduce waste, conserve energy, and optimize resources. While many discussions on sustainability center around materials or energy-efficient processes, PCB design is an often overlooked factor that lies at the heart of manufacturing. Good design practices, especially those based on established IPC standards, play a central role in enabling sustainable PCB production. By ensuring designs are manufacturable and reliable, engineers can significantly reduce the environmental impact of their products.