It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
SEMI-FlexTech Launches Six New Projects to Accelerate Flexible Hybrid Electronics Innovation
February 11, 2020 | SEMI-FlexTechEstimated reading time: 2 minutes
SEMI-FlexTech has announced the launch of six projects to accelerate sensor and sensor system innovations for new applications in industries including healthcare, automotive, industrial and defense. In collaboration with the U.S. Army Research Laboratory (ARL), FlexTech, a SEMI Strategic Association Partner, will provide more than $2.3 million in funding for the projects aimed at maturing the flexible-hybrid electronics (FHE) technology ecosystem. Organizations including the University of Texas El Paso, American Semiconductor, PARC, Tekscan, Alertgy and SAFI-Tech will lead the initiatives.
SEMI & FlexTech
“Flexible hybrid electronics give product designers new ways to use sensors to collect data and deliver actionable insights that improve how we work and live,” said Melissa Grupen-Shemansky, CTO of SEMI and Executive Director of SEMI-FlexTech. “This new round of projects epitomizes the wide range of applications enabled by innovations in flexible hybrid electronics. We expect this body of work to unearth new product roadmaps across the electronics industry.”
Projects
American Semiconductor, Inc., will develop 500 FHE ultra-thin, lightweight and configurable sensor systems with wireless capability for environmental sensing applications. ASI will partner with Boise State University, DuPont, HD Microsystems and ITN Energy Systems on the 15-month project.
The University of Texas at El Paso will optimize structural and electrical performance and develop sculpted dielectrics for FHE 3D printing. The 12-month project will generate performance data and new algorithms for smarter 3D printing. A proof-of-concept, journal article and presentation will cap the project.
Tekscan will develop a functioning sensorized glove made of a durable resin with flexible-conductive and pressure-sensitive inks. The glove advances the state of the art for FHE pressure and force measurements and analysis, critical in design evaluation for automotive, consumer, packaging, robotics and medical devices. The 18-month project includes examinations of novel substrates and materials, hardware integration strategies, and manufacturing methods.
PARC, A Xerox Company, will integrate a flexible and adaptable multi-sensor system (consisting of temperature, humidity, impact and gas sensors) with a single processor for data capture and both wireless and audio output capabilities. The system will target applications in the wearables, medical monitoring, Internet of Things (IoT), automotive and industrial markets. PARC will partner with Purdue University in this 12-month project.
Alertgy will develop a curved, flexible and lightweight wrist-mounted FHE for non-invasive glucose monitoring. The wristband will incorporate electrical impedance spectroscopy (EIS), a transducer and a printed battery. The device interface will enable the integration of other sensors into its multipurpose design. A demonstration of the platform will culminate the 16-month project.
SAFI-Tech will develop and demonstrate screen-printed, supercooled liquid metal particles for use in electrical interconnects at low temperatures as a replacement for electrically conductive adhesives (ECAs). Lower temperatures in electronics manufacturing can reduce heat generation, processing costs and thermal damage to components while enabling higher throughput for devices in defense, automotive, healthcare and other industries. SAFI-
Share on:
Suggested Items
NEOTech Significantly Improves Wire Bond Pull Test Process
11/25/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.