It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Alpha Insights, Performance by Design: The Future of PCB Manufacturing in the Midwest
Happy’s Tech Talk #43: Engineering Statistics Training With Free Software
I-Connect007 Publishes Third Annual Show & Tell Magazine All About IPC APEX EXPO 2020
February 19, 2020 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Welcome to the third annual Real Time with… IPC APEX EXPO 2020 Show & Tell Magazine.
This special publication is a supplement to our other monthly magazines and brings you exclusive, in-depth coverage of the recent event. These pages are packed with tons of great content, including event photos, video interviews, attendees’ thoughts, reviews from our guest contributors and I-Connect007 editors, interviews with award winners and other industry experts, and coverage of another successful IPC STEM Student Outreach Program.
If you couldn’t make it to San Diego, don’t worry. This edition of Show & Tell Magazine brings you coverage of the entire show, including “A Night of Happy-ness” with Happy Holden, I-Connect007’s Good for the Industry Award recipients, keynote presentations by Burt Rutan and Elaine Larsen, and much more.
Download Real Time with… IPC APEX EXPO 2020 Show & Tell Magazine here.
Also, be sure to visit Real Time with...IPC APEX EXPO 2020 for detailed video interviews and photo coverage of this year's show. See a photo you'd like to share? Go ahead and download it from our gallery. Please give us credit or a link to our Real Time with... site if you choose to post it on your site or social media page.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.