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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Burkle North America: New Equipment and ‘New Blood’ in the Industry
February 21, 2020 | Real Time with...IPCEstimated reading time: Less than a minute

During IPC APEX EXPO in San Diego, California, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers.
During the show, Guest Editor Dick Crowe and Kurt Palmer, president and CEO of Burkle North America, discuss Kurt's career history and responsibilities in his present role. Palmer also details the equipment that the company is exhibiting on the show floor, and the palpable excitement that veteran technologists feel this year seeing younger engineers and students attending IPC APEX EXPO 2020. There’s a lot of “new blood” in the industry, as Palmer explains.
IPC APEX EXPO is the largest PCB industry event in North America. The next IPC APEX EXPO will be held January 26-28, 2021, at the San Diego Convention Center.
To watch this interview, click here.
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The Knowledge Base: Building the Workforce of Tomorrow With EMAC
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