Intervala Signs Manufacturing Agreement with New Customer Noregon Systems
March 4, 2020 | Intervala, LLCEstimated reading time: Less than a minute
Intervala, LLC, a full-service manufacturer of high-reliability, precision electronic and electromechanical products, announced today that it has signed a manufacturing agreement with new customer Noregon Systems, Inc. Products manufactured by Intervala will be used in Noregon’s proprietary large-vehicle diagnostic equipment, which collects and analyzes real-time vehicle health and performance data. Intervala will manufacture the products at its facility in the greater Pittsburgh area.
“We are excited to be selected by Noregon to support their advanced, IoT (internet of things) vehicle diagnostics technology,” said Teresa Huber, president and CEO of Intervala. “Noregon is the industry-recognized authority on connected vehicle solutions, and we are extremely pleased to welcome this innovative company to our growing list of successful global customers.”
“This partnership with Intervala creates tremendous value for our customers,” said Tim Bigwood, Noregon’s CEO. “Their expertise empowers us to continue to enhance our industry-leading connected vehicle solutions that organizations rely on to maximize uptime in their fleet.”
Suggested Items
IMI Welcomes New CEO
05/03/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI),The IMI Board of Directors announced, in a disclosure dated April 25, 2024, the appointment of Louis Sylvester Hughes, Chief Executive Officer (CEO).
Gstar Announced the Strategic Move: Groundbreaking of Silicon Wafer Factory Construction in Indonesia
05/03/2024 | PRNewswireRecently, Gstar held a groundbreaking ceremony for its silicon rod and silicon wafer factory, marking the beginning of the rapid construction phase.
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers
05/02/2024 | I-Connect007In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback.
The New Industry: Will the Growth Continue?
04/30/2024 | I-Connect007 Editorial TeamHow sustainable are the primary financial models in the United States regarding PCB fabrication shops? In this interview with economic experts Shawn DuBravac and Tom Kastner, we explore what’s happening with U.S. printed circuit board shops in today’s market, how consolidation affects the industry, and what can be done.