It’s Only Common Sense Mastering the Follow-Up—The Key to Closing More Deals
Driving Innovation: Registration in PCB Production Throughout the Process
Dan's Biz Bookshelf: 'Getting Naked: A Business Fable'
IPC APEX EXPO 2020 Attendees Speak: Scott Pohlmann
March 5, 2020 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Scott Pohlmann is director of business development for Milwaukee Electronics
Kelly Dack: What interesting things have you seen at this show?
Scott Pohlmann: As a salesman, my job is to make sure I stay on the cutting edge of technology. When our customers ask for certain features that they need on their equipment or performance, I need to know what the state-of-the-art equipment, profiles, and procedures are out there. The SPI process, in particular, is becoming more important. People are realizing how important solder paste deposition is, and looking at that is so much more important than after the oven if you want to get a good paste print.
Dack: Are you looking at it with 3D?
Pohlmann: Five series 3D, so you’re looking at up to five different features, not just if the paste is there, but also if it is the proper volume. Does it match the IPC solder paste standard? All those things help to instill confidence in new customers.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.