-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Flexible Circuit Design Guidelines
March 5, 2020 | Flexible Circuit TechnologiesEstimated reading time: 1 minute
Flexible circuit designs share many of the same challenges of rigid PCB designs, but there are also many differences and additional challenges. The very nature of a flex circuit being able to bend and flex make it as much a mechanical device as an electrical one. This creates a special set of requirements unique to flexible circuitry. Understanding how these requirements interact will allow the PCB designer to create a flex circuit that balances the electrical and mechanical features into a reliable, cost-effective interconnect solution.
Overview
Scrutinize your design for stress concentration features. Stress concentration features are the single predominant cause for mechanical failures in flexible circuits (i.e., cracked/broken conductors, torn insulating material, etc.). To avoid stress concentration points, the construction of the circuit should not change in, or immediately adjacent to, the bend area. In a bend area, there should be no change of conductor width or thickness or direction, no termination of plating or coatings, no openings in covers or outer insulating materials, and no holes of any kind in a bend zone.
Bend Ratio
Determine and evaluate the minimum bend ratio of your design. This will be your single best indicator of whether your flex circuit may experience problems in service. Bend ratio is bend radius: circuit thickness.
To read this entire article, which appeared in the January 2020 issue of Design007 Magazine, click here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
OE‑A Publishes 10th Edition of the Roadmap for Flexible and Printed Electronics
04/22/2026 | OE-AWith the publication of the 10th edition of the “OE-A Roadmap for Flexible and Printed Electronics,” the OE-A, an international working group for printed electronics within the VDMA, once again presents the central guidance and reference document for the industry.
Global Flexible PCB Market to Nearly Double, Reaching $41.7 Billion by 2030
04/03/2026 | Globe NewswireThe global flexible printed circuit board (FPCB) market is projected to grow from $21.5 billion in 2024 to $41.7 billion by 2030, reflecting a compound annual growth rate (CAGR) of 12.3%, according to a new report from BCC Research.
China’s Top 3 FPC Manufacturers 2026: Advancing Sustainable Flexible Electronics
03/25/2026 | EINPresswire.comThe global transition towards compact, lightweight, and durable electronic devices is accelerating demand for advanced Flexible Printed Circuits (FPCs).
SMT Renting: Redefining Equipment Investment
03/24/2026 | Marcy LaRont, I-Connect007SMT Renting, based in Copenhagen, is challenging the traditional machine-ownership model with a flexible, service-based approach. Business Manager Christian Thers discusses how rental options, “stop and swap” flexibility, and a new pay-per-placement model help electronics manufacturers reduce risk and adapt quickly in an unpredictable market.
Global Market for Flexible Manufacturing Systems Set to Surge to $22.2 Billion by 2030
03/02/2026 | GlobeNewswireAccording to the latest study from BCC Research, “Global Market for Flexible Manufacturing Systems” is expected to increase from $15.2 billion in 2025 to $22.2 billion by the end of 2030, at a compound annual growth rate (CAGR) of 7.9% from 2025 through 2030.