Dan's Biz Bookshelf: 'Move Your Bus'
Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Ventec Re-Certified to AS9100 Revision D in UK
March 10, 2020 | Ventec International GroupEstimated reading time: 2 minutes
Ventec International Group Co., Ltd., a world leader in the production of polyimide and high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions, is pleased to announce that the company’s European headquarters in Leamington Spa, UK has successfully been re-certified with AS9100 Revision D in accordance with the Aerospace Supplier Quality System Certification Scheme EN 9104-001:2103 by SGS.
Ventec’s UK and China facilities are certified to AS9100 Revision D quality standard, providing OEMs and PCB fabrication customers servicing the aviation, space and defense industries access to a fully accredited supply chain for high reliability laminates and prepregs. This standard includes ISO 9001:2015 quality management system requirements and specifies additional aviation, space and defense industry requirements, definitions and notes.
To qualify and meet the strict certification criteria of the certification, Ventec’s material manufacturing & supply processes undergo a thorough assessment for stringent aerospace requirements. Attaining and maintaining certification is critical to Ventec’s mission to consistently offer aerospace- and automotive-grade materials to the market.
Anthony Jackson, General Manager of the UK facility commented: “Achieving and maintaining highest quality standards is the key to our success and continued growth. I am delighted with our successful re-certification audit which reflects the hard work of the entire Ventec team in implementing and practicing the highest levels of process quality. Our commitment to managing delivered quality to the highest standards provides our customer with the reassurance of being their strategic partner of choice in their own safety critical supply chains.”
From manufacture through fabrication and global delivery, Ventec's high quality product portfolio of polyimides, high reliability FR-4, tec-speed range of high speed/low loss materials and tec thermal range of IMS materials are all covered by the accreditation.
For more information about Ventec's solutions and the company's wide variety of products, please visit www.venteclaminates.com.
About Ventec International Group
Ventec International Group Co., Ltd. (6672 TT) is a premier supplier to the Global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper clad glass reinforced and metal backed substrates. Ventec materials, which include high-quality enhanced FR-4, high-speed/low-loss- and high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support-network. For more information, visit www.venteclaminates.com.
Share on:
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.