Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
Advantages of Using ZIF Connectors as a Termination Method
March 17, 2020 | All FlexEstimated reading time: 1 minute
Application: Advantages and Information About ZIF Connectors
There are many types of connectors and termination methods available when designing a flexible circuit. One of the most common is the zero insertion force (ZIF) connector. The reason why the ZIF connector is so popular is that they eliminate the requirement for an added connector. They create a direct connection from the circuit to the mating connector reducing overall weight and cost. Here are a few general facts about ZIF connectors.
1. ZIF Connectors Capabilities and Requirements
- Our equipment allows us to hold ±0.002” tolerance on overall width
- The standard allowable thickness tolerance for 0.012” connectors is ±0.002”
- Specialized material sets have allowed us to hold ±0.001” thickness tolerance on ±0.012” requirement applications verified through multiple capability studies
2. Finishes of ZIF Connectors and Matching With Mating Connector
- Applications that require multiple insertions or greater mechanical force applications (membrane switches) should use hard electrolytic nickel gold (Ni/Au)
- Applications that are static or flex-to-install may only use ENIG/Tin/HASL, depending on the mating connector. It is important to match surface finishes with the contact finishes to inhibit corrosion, especially with tin and gold
- Electroless nickel immersion gold (ENIG) is our most common ZIF plating method and allows for solderability and one surface finish across the entire flex board
3. ZIF Stiffeners
- Polyimide is the most common material added to our standard flex circuit (polyimide) stackup to meet the final ZIF thickness requirement, which is typically 0.012”. Many ZIF connectors have some type of latching mechanism that allows the flex to be inserted and then ultimately clamped down using this latching mechanism
- For ZIF connectors that do not have a latching mechanism, we have utilized an F-R4 (rigid) material as the increased thickness material. The rigid material has the copper etched off which creates a “tooth” for the connector to grab onto versus the polyimide material, which is a smooth material
- ZIF stiffeners are designed to overlap the conductors; 1 mm is the minimum requirement, but 2.5–3 mm is recommended. This provides a “finger hold” for insertion to the connector and prevents mechanical stress and cracking of the conductors. The following images depict the correct design:
Disclaimer
Data presented for informational purposes only. Actual values and/or usage is for reference.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in