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This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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IPC Events: COVID-19 Updates for 2020
April 3, 2020 | IPCEstimated reading time: 1 minute
We at IPC sincerely hope that you and your families are staying safe during this unprecedented global crisis. The effects of COVID-19 are creating new challenges as we adjust to sheltering in place. You can find current information on scheduled events as well as IPC’s response to the crisis on the COVID-19 (Coronavirus) Update page on IPC.org.
Because the health and safety of our attendees, speakers, exhibitors, sponsors and employees is of utmost importance, some of IPC’s planned events for 2020 have been either postponed or transformed into virtual events.
The current updates are as follows:
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High Reliability Forum, scheduled for May 2020, has been rescheduled for May 11-13, 2021.
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Electronics Materials Forum, scheduled for June 2020, has been postponed. New date to be announced soon.
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IPC/ITI Conference, scheduled for June 2020, will now be a virtual event. Date to be announced soon.
Upcoming Events
The events listed below are scheduled as planned and we are closely monitoring the situation for all in-person events. Changes to the schedule will be reflected on the IPC Calendar and announced on the COVID-19 (Coronavirus) Update page.
Wisdom Wednesday Webinar: Building Synergies in Power Electronics Members Only
April 8
10:00 am–10:45 am CDT
IPC SummerCom | Raleigh, NC
June 13–June 18
IPC Cares | Global Virtual Event
June 14–June 20
IPC E-Textiles 2020 | Minneapolis, MN
September 29–September 30
High-Reliability Cleaning and Conformal Coating Conference, in cooperation with SMTA
November 3–November 5
M-EXPO Wire Processing Technology
October 14–October 16
IPC APEX EXPO 2021
January 23–January 28
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.