Trackwise's 'Improved Harness Technology' Designed into Circuits for Electric Vehicles
April 30, 2020 | Trackwise Designs PLCEstimated reading time: 1 minute
Trackwise Designs has secured a production order for its flexible printed circuit technology, Improved Harness Technology™ (IHT), for delivery in mid 2020. This initial order, in support of initial vehicle production activities, follows successful funded development activities last year for this UK-based designer and manufacturer of electric vehicles.
Trackwise’s IHT is a proprietary roll-to-roll manufacturing process enabling the production of unlimited length, multilayer flexible printed circuits (FPCs). Trackwise’s roll-to-roll technology is being used to manufacture FPCs for use at a module level in both HV and LV circuits in the vehicles' battery packs, reducing the part count, assembly time, and saving on space and weight.
Electric vehicle battery modules are typically cuboid structures of packaged cells which have precisely defined cell connection or monitoring locations that are ideally suited to flex PCBs.
In addition, when battery modules are packaged together to form a complete vehicle battery pack, the battery modules can be connected together by long-length flex PCBs, sometime several metres in length.
Philip Johnston, CEO of Trackwise, commented: "The electric vehicle industry—and specifically EV battery packs—is one of a number of growth markets for Trackwise, and we are delighted to have been selected by an innovator in the field. Following successful development work last year and, more recently, the acquisition of Stevenage Circuits Ltd (SCL) at the beginning of April, this is the next step towards series production of IHT at scale."
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).