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Advanced Packaging, Materials Characterization, and System Integration: What’s Ahead in the Advanced Electronics Packaging Digest

08/11/2026 | I-Connect007 Editorial Team
The August issue of Advanced Electronics Packaging Digest explores how advanced packaging is reshaping semiconductor innovation through better materials characterization, heterogeneous integration (HI), workforce education, and system-level design. Together, these features examine the technologies and engineering decisions driving the next generation of electronic systems.

Sarla Aviation Scales Urban Air Mobility with Siemens Xcelerator

08/07/2026 | Siemens
Siemens announced that Sarla Aviation is using the Siemens Xcelerator portfolio of industry software to accelerate the development of its next-generation electric vertical take-off and landing (eVTOL) aircraft for urban air mobility.

CELUS, Variscite and NXP Enable AI-Driven Embedded Design

08/06/2026 | BUSINESS WIRE
CELUS, the AI-driven electronics design automation provider, announced a strategic partnership with Variscite, a leading provider in the System on Module (SoM) industry.

Designing for the Human Eye: Three Lessons Every PCB Designer Should Know About LED Displays

08/06/2026 | Stephen V. Chavez, Siemens EDA and PCEA
A display is one of the few electronic subsystems where PCB design decisions become visible to the end user. A few milliohms of resistance, a slight impedance discontinuity, or a few degrees of temperature difference may never matter elsewhere in the product. In an LED display, however, those same design decisions can become a visible defect. Behold the power of the human eye. Over the years, I've reviewed hundreds of PCB layouts spanning everything from industrial controls and aerospace electronics to medical devices and high-speed computing systems. Every design presents its own unique challenges, but display electronics have always stood apart.

3 Key Takeaways: Design for Test Starts Long Before the First Test

08/05/2026 | I-Connect007 Editorial Team
Design for test has traditionally been viewed as the last checkpoint before a product enters production. Bert Horner's The Printed Circuit Assembler's Guide to... Design for Test challenges that thinking. In his book, he argues that testability should influence every stage of PCB and CCA development, from the first schematic through layout, manufacturing, inspection, and long-term product support. The result is a practical guide that connects engineering decisions with measurable manufacturing outcomes.
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