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Just Ask Happy: The Future of Mechanical Blind, Buried Vias
June 26, 2020 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.
Q: Do mechanical blind and buried vias have a future?
A: Yes, especially for the newly invented VeCS technology, which uses a mechanical drill to gain the same density as laser-drilled microvias, but with higher reliability. For more information, read this series on VeCS technology by Joan Tourné of NextGin Technology, which ran in PCB007 Magazine in 2019 (also read Part 2, Part 3, and Part 4).
To pose your own question for Happy Holden, take the survey by clicking here.
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