Microchip Delivers the Smallest Automotive maXTouch Controllers for Smart Surfaces and Multi-Function Displays
June 30, 2020 | Globe NewswireEstimated reading time: 2 minutes
To help enhance and ease today’s driving experience, automotive manufacturers are implementing additional touch displays beyond the center infotainment display (CID). Supporting the application of these secondary displays with advanced features, Microchip Technology Inc. announced the extension of its market-leading maXTouch® portfolio with the new MXT288UD touch controller family, the industry’s smallest automotive grade packaged touch screen controllers. The MXT288UD-AM and the MXT144UD-AM devices offer low power mode, weatherproof operation and glove touch detection in multi-function displays, touch pad and smart surfaces for vehicles, motorcycles, e-bikes and car-sharing services.
Secondary touch surfaces can be placed in both the interior of cars and exterior of a motor vehicle, such as handlebars, doors, electronic mirrors, control knobs, the steering wheel, between seats or in an armrest. With the MXT288UD family’s small 7x7 mm automotive grade VQFN56 package, tier one suppliers can now reduce board space by 75 percent and greatly minimize the overall Bill of Materials (BoM) for these compact applications — all while exceeding the requirements for excellent and reliable touch performance in the market. The family’s low power wait-for-touch mode consumes less than 50 µA, remaining responsive for the user, even if the display switches off to save power or to avoid disturbing the driver at night. The system will wake by a touch event anywhere on the touch surface.
In addition, the MXT288UD-AM and the MXT144UD-AM devices enable detection and tracking of multi-finger thick gloves through a wide variety of overlay materials and thicknesses, like leather, wood or across uneven surfaces — even in the presence of moisture. Normally the dielectric constant of these overlay materials would limit the detection of the touch, however these devices provide a unique solution to reliably detect and track multi fingers with a high signal-to-noise ratio (SNR) and through a proprietary differential mutual acquisition scheme. For example, in car sharing applications, this reliable touch functionality helps users access a car from the outside by tracking touch coordinates on an exterior display in any environment, like rain, snow or extreme heat. Motorcycles and other motorbike vehicles also benefit from such weatherproof designs. As a turnkey solution, the MXT288UD family provides proven firmware, developed according to Automotive SPICE® processes and is AEC-Q100 qualified — making it easy for today’s automotive manufacturers to integrate into existing systems at a lower risk with faster time to market.
“Automotive OEMs are looking to enhance the user experience through smart surfaces and multi-function displays, while still providing a convenient and distraction free environment,” said Fanie Duvenhage, vice president of Microchip’s human machine interface and touch function group. “Addressing these needs in the market, Microchip is building on its already leading portfolio of automotive touchscreen solutions with the new MXT288UD touch controller family — bringing increased performance and cost savings to the industry’s smallest package of automotive grade touch controllers.”
Development Tools and Design Services
Both software and hardware support are available. Software tools includes maXTouch Studio and a maXTouch analyzer. For the MXT288UD, the hardware offered includes an evaluation kit with a printed circuit board (PCB) and a 5” capacitive touch panel, while the MXT144UD’s evaluation kit includes a PCB and a 2.9” capacitive touch pad. For both devices, a bridge PCB is included with a USB connection for interfacing to a computer when running maXTouch Studio.
To help with the development and tuning of touch sensors and integration into the final application, Microchip’s touch function group and field application engineers provide best-in-class, worldwide support.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
Podcast Episode 2—AI Is Changing the Rules: Are Your PCB Materials Ready?
03/10/2026 | I-Connect007I-Connect007 announces the release of the second episode in its new six-part podcast series, PCB Materials: The Backbone and Future of Electronics. In “5G, AI & Beyond—Designing for High-Speed Performance,” we explore how artificial intelligence is reshaping the rules of electronics design, demanding unprecedented speed, power, and high-frequency performance that push beyond the limits of traditional materials. As AI applications scale rapidly, are yesterday’s materials becoming obsolete?
STMicroelectronics Completes Acquisition of NXP’s MEMS Business
02/03/2026 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, completed the acquisition of NXP Semiconductors’ (NASDAQ: NXPI) MEMS sensors business.
MacDermid Alpha White Papers: Practical Materials Guidance for Modern Electronics
01/27/2026 | I-Connect007The I-Connect007 Industry Resource Center brings together technical white papers from leading suppliers to help electronics professionals navigate today’s manufacturing and reliability challenges. Built as an educational hub, the Resource Center connects engineers and manufacturers with application-focused guidance on materials, processes, and performance considerations shaping modern electronics.
Real Time with... productronica 2025: Navigating Changes in the EMEA Market—Insights from Ventec Experts
12/10/2025 | Real Time with...productronicaVentec's Mark Goodwin and Pesh Patel explore the EMEA market's structural changes, including Panasonic's factory closure and its effects on laminators. They discuss the transition to low DK glass and the influence of the AI boom. Mark highlights the need for effective inventory management, while Pesh presents the glass-free revolution, showcasing new materials and resin technologies that improve performance and expand applications beyond traditional circuit boards.