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Advanced Electronics Packaging Digest: Third Issue Arrives November 17
November 12, 2025 | I-Connect007Estimated reading time: Less than a minute
The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging.
Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies. The event highlighted how collaboration among research institutions, manufacturers, and supply chains is accelerating innovation and bridging the gaps between design and production.
Marcy LaRont explores the UHDI revolution—the point where PCB manufacturing meets substrates and interposers to form the foundation of next-generation systems. She discusses how UHDI is redefining density, precision, and performance, setting new benchmarks for the entire electronics ecosystem.
Finally, Elephantech showcases how additive manufacturing is igniting a sustainability revolution in electronics. Through breakthroughs in printed circuitry, Elephantech demonstrates that greener, more efficient production can seamlessly align with cutting-edge design and performance.
From sustainability to system-level integration, this issue captures the pulse of an industry in transformation.
Don’t miss the conversations shaping the future of microelectronics!
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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.Subscribe now to stay informed, competitive, and connected.
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