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Advanced Electronics Packaging Digest: Third Issue Arrives November 17
November 12, 2025 | I-Connect007Estimated reading time: Less than a minute
The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging.
Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies. The event highlighted how collaboration among research institutions, manufacturers, and supply chains is accelerating innovation and bridging the gaps between design and production.
Marcy LaRont explores the UHDI revolution—the point where PCB manufacturing meets substrates and interposers to form the foundation of next-generation systems. She discusses how UHDI is redefining density, precision, and performance, setting new benchmarks for the entire electronics ecosystem.
Finally, Elephantech showcases how additive manufacturing is igniting a sustainability revolution in electronics. Through breakthroughs in printed circuitry, Elephantech demonstrates that greener, more efficient production can seamlessly align with cutting-edge design and performance.
From sustainability to system-level integration, this issue captures the pulse of an industry in transformation.
Don’t miss the conversations shaping the future of microelectronics!
Not yet subscribed? Subscribe now to stay informed and ahead of the curve.
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12/08/2025 | Real Time with...productronicaMarcy LaRont introduces Michael Hanke at the Rehm booth, where they highlight the busy atmosphere and innovative machines. They discuss the new reflow soldering, formic acid integration, and the machine's efficiency. The focus is on green technology, data reporting, and software integration, including AI components.
Incap Acquires Lacon Group, Expands into Defense and Design Services
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Koh Young, Fuji America, and Creative Electron Unite to Launch The SMT Future Experience
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Zhen Ding Posts November 2025 Monthly Revenue Report
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/05/2025 | Marcy LaRont, I-Connect007It’s been another big week in global business news with positive projections on global economic growth, primarily driven by AI. U.S. labor markets are showing some strain after copious layoff activity, and there’s possibly a slight “correction” in the stock market, with investors apparently concerned about corporate overvaluation. My must-reads are interesting, informative, and important for industry members, particularly in the U.S. These selections range from onshoring high-tech thermal control to the value of training, recognizing interconnect defects, and an important statement from the Global Electronics Association regarding the USMCA.