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TRI Wins Two EM Asia Innovation Awards for AOI and ICT
July 8, 2020 | TRIEstimated reading time: Less than a minute
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, announces that it was awarded two 2020 EM Asia Innovation Awards in two categories. The TR7700Q SII won the Test Equipment: AOI award. The TR5001 SII LED Series ICT was awarded Outstanding Product of the Year. The award ceremony was held during the 2020 Productronica China exhibition in Shanghai, China.
The TR7700Q SII is powered by TRI's Smart Library with auto-learning functionalities, flexible inspection algorithms, and metrology capabilities for exact measurements and data exchange for Smart Factory applications. The TR7700Q SII AOI is enhanced with a high resolution of 10 µm optical resolution and a 12MP high-speed camera. TRI's next-generation AOI has improved image quality at the industry-leading speed of up to 57cm2/s.
The TR5001 SII LED Series is TRI's latest ICT+FCT innovation dedicated for LED lighting Tests, equipped with up to 1080 LED Test Channels. The ICT+FCT solution offers Multi-Core Parallel testing with up to 4 independent cores and built-in auto-calibration and self-diagnostics to ensure long-term testing reliability. The TR5001 SII LED Series is suitable for the Automotive Industry LED Lighting Testing.
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Global Electronics Association and CalcuQuote, an Elisa Industriq Business, Launch Joint Supply Chain Intelligence Initiative
04/29/2026 | Global Electronics AssociationThe Global Electronics Association and CalcuQuote, Elisa Industriq today announced a partnership to deliver timely, actionable supply chain intelligence for the electronics industry.
Is China Plus One Still Happening in the PCB Industry?
04/28/2026 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.For much of the past five years, China Plus One has been shorthand for supply-chain diversification: reducing dependency on mainland China by adding manufacturing capacity elsewhere in Asia. In the PCB industry, however, in early 2026, it is more nuanced. It looks less like a clean geographic shift and more like a layered, capital-intensive rebalancing of global capacity, one that still leaves China deeply embedded at the center.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
Meet Emerging Engineer Dennis Donovan, Kratos Space Commercial
04/29/2026 | Michelle Te, I-Connect007Like many of today’s engineers, Dennis Donovan grew up interested in how things worked. He wanted to see what was inside and how to make it better. Now, he has three bachelor’s degrees, is earning his master’s, and works as an electrical engineering technologist. He aspires to work in PCB assembly with a particular focus on aerospace electronics. He’s a sharp, well-spoken young man with an eye on his future.
Call for Abstracts for Third Pan-European Electronics Design Conference
04/27/2026 | Global Electronics AssociationThe German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the Third Pan-European Electronics Design Conference (PEDC).