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Indium Corporation Releases Report on Indium, Gallium Availability
July 17, 2020 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation, worldwide leading expert for indium metal, has released a report on the worldwide availability of indium and gallium metal.
Availability of Indium and Gallium, co-authored by Indium Corporation experts Claire Mikolajczak, Director, Metals & Reclaim, and Shuyan Peng, Strategic Sourcing Buyer, is the most recent in a series of papers designed to provide important industry insight on market trends and the supply of indium and gallium. The paper, which is available for citation, also includes an overview on indium and gallium supply, demand, and popular uses.
Indium Corporation was founded in 1934 as a result of Dr. William Murray’s research on the element indium, and who was responsible for bringing the very first gram of pure indium to the United States. Since then, through decades of Indium Corporation’s research and development, applications have multiplied as its unique properties are explored for new solutions to industry issues for today and the future.
Availability of Indium and Gallium is an important resource for researchers looking for ways to develop new or updated current technology with indium and gallium metals. To view this and other papers authored by Indium Corporation experts, visit www.indium.com/techlibrary.
About Indium Corporation
Indium Corporation was founded in 1934, based on the research performed by Dr. William Murray, the man who brought the very first gram of pure indium to the United States. Through the subsequent decades of Indium Corporation’s research and development, applications have multiplied as indium’s unique properties are applied to a multitude of new industry opportunities.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
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The New Industry: Will the Growth Continue?
04/30/2024 | I-Connect007 Editorial TeamHow sustainable are the primary financial models in the United States regarding PCB fabrication shops? In this interview with economic experts Shawn DuBravac and Tom Kastner, we explore what’s happening with U.S. printed circuit board shops in today’s market, how consolidation affects the industry, and what can be done.
TTM’s High Tech Expansion and Industry Innovation
04/30/2024 | Marcy LaRont, PCB007 MagazineTom Edman has been the CEO of TTM Technologies since 2014 and has an extensive background in electronics and manufacturing. TTM is a leading global manufacturer of technology solutions, including mission systems, RF component and RF microwave microelectronics assemblies, and quick turn and advanced technology printed circuit boards.
U.S. Companies Invest Heavily in Robots
04/30/2024 | IFRManufacturing companies in the United States have invested heavily in more automation: total installations of industrial robots rose by 12% and reached 44,303 units in 2023. Number one adopter is the car industry followed by the electrical and electronics sector.
USPAE to Springboard U.S. Technology Forward
04/30/2024 | Marcy LaRont, PCB007 MagazineThe U.S. Partnership for Assured Electronics (USPAE) was launched as a nonprofit subsidiary of IPC in 2020, specifically to manage the DoD relationship and access to funding, and to develop a cooperative facility to develop UHDI capabilities in the U.S., not only for the defense sector, but for the whole of the U.S. electronics industry. It is a tall order, but industry veteran Joe O'Neil believes it will happen. Having been tasked with making the UHDI Capable Cooperative Production Facility (UCCPF) a reality, he provides an update on this important project for U.S. electronics manufacturing.
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung ElectronicsSamsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.