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IPC APEX EXPO Deadline Extended for Virtual Presentation Proposals
July 21, 2020 | IPCEstimated reading time: 1 minute

IPC has extended the deadline for IPC APEX EXPO 2021 technical conference abstracts to Monday, August 31. Because of travel restrictions by some companies and geopolitical areas, IPC is also accepting proposals for virtual presentations. IPC APEX EXPO 2021 technical conference will take place January 26–28 and professional development courses will run January 23–28.
The industry’s premier conference and exhibition for electronics manufacturing in North America, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide.
- Topics being sought within the following categories include
- Factory of the Future Implementation
- Enabling Future Technologies
- Meeting Extreme Requirements
- Conscientious Engineering
- Circuit Design and Component Technologies
- Assembly Processes PCB Fabrication and Materials
- Electronics Materials
- Quality, Reliability, Test and Inspection
An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.
Visit ipcapexexpo.org/cfp for a comprehensive list of topics. For more information about conference participation or professional development, please contact Toya Richardson at ToyaRichardson@ipc.org or 847-597-2825.
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10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
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North American EMS Industry Shipments Down 1.4% in August
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10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.