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Just Ask Happy: What Would You Change About the Industry?
July 28, 2020 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut by covering technology, the worldwide fab market, and everything in between. Enjoy.
Q: If you could change/improve one aspect of this industry, what would it be, and why?
A: TQM/continuous improvement (or Six Sigma) is a philosophy that has stuck with me since I was first exposed to it. I even taught the engineering aspects of TQM to every one of my engineers and techs; this included engineering statistics from the free NIST Engineering Statistics Handbook, as well as enhanced problem solving. Then, I would have my engineers teach TQM to their production supervisors, foremen, and leads, who would—with the help of the engineers and techs—teach it to all of the workers.
Continuous improvement is a strategy for success. And in our challenging industry characterized by innovation and change, continuous improvement and customer satisfaction are the only ways to survive and prosper.
To pose your own question for Happy Holden, take the survey by clicking here.
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Sweeney Ng - CEE PCBSuggested Items
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SEMI Foundation Honors Applied Materials at SEMICON West with 2025 Excellence in Achievement Award for Talent Development
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
11/03/2025 | Real Time with...SMTAIMarcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.