Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Dan’s Biz Bookshelf: ‘Growth Hacker Marketing’
Happy’s Tech Talk #38: Novel Metallization for UHDI
8 Measures for Sales and Operations Planning in Turbulent Times, Part 5
August 5, 2020 | Fane Friberg, CEPHASEstimated reading time: 1 minute
In this series, CEPHAS principal Fane Friberg highlights the interdependent elements of an effective S&OP process for leaders of supply chain management. While some companies tend to fall back on the status quo, Freiberg highlights why it’s critical to actually increase the frequency of the S&OP rather than decrease the operations. He has reviewed the importance of staying committed, strategic imperatives, participation, and technology. Today, he discusses rough-cut capacity planning.
Focus #5: Rough-Cut Capacity Planning
After the S&OP data is loaded, now you need to look at your rough capacity. Is the current demand profile going to be facilitated by your business operations? Are there enough human resources in the correct skillset for the schedule? What about machines and methods?
This step is used as an acid test to ensure that the manufacturing control/execution system or job shop environments can react adequately to the changes, including internal disturbance (e.g., equipment failures, rework) and external disturbance (e.g., variations in customer demand); on the other hand, one must optimize multiple logistic objectives and have short throughput times, low work-in-process (WIP) rates and high schedule reliability to achieve the plan.
This validation point is to substantiate that the enterprise can deliver quality goods-and-services on-time within the existing cost structure. This is not the step to force schedule compression, overtime, expedites, etc. This is a good point in the process to highlight your constraints and begin to strategize how to exploit the constraint(s) and subordinate everything else in the analysis.
For example, James Clear posted the following idea [1]:
“When failure is expensive, plan carefully.
When failure is cheap, act quickly.”
References
- J. Clear, “3-2-1: On failure, the importance of teaching, and handling the expectations of others,” February 20, 2020.
Fane Friberg is principal of CEPHAS.
Share on:
Suggested Items
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP SemiconductorNXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.
Scanfil Boosts Investment in Electronics Manufacturing in the US
05/08/2025 | BUSINESS WIREScanfil is investing in a second electronics manufacturing line in Atlanta, Georgia, USA. The demand for manufacturing electronics in the USA has increased over the past two years and is expected to continue growing.
ZESTRON Announces New Reliability and Solutions Service for Risk Assessment & Mitigation of Electronic Assemblies
05/06/2025 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions, is thrilled to introduce its new Reliability and Solutions (R&S) service.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.