Trouble in Your Tank: Understanding Interconnect Defects, Part 1
It’s Only Common Sense: Marketing Isn’t Fluff, It’s Ammunition
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
August 21, 2020 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute
This week, the top five is full of progress in technology and financial performance. It’s more evidence that the electronics industry, at its core, continues to thrive.
I-Connect007 strives to create original content that sparks meaningful conversation inside the industry. Whether it’s our new “Just Ask” series—currently featuring Joe Fjelstad—news and articles that provoke thought, or coverage of new manufacturing techniques, we encourage you to share your reactions, opinions, and comments on the news we bring you. Your readership tells us what pieces interest you, and your comments tell us why. So, c’mon, let’s talk!
New Solder Joint Technology From Schmartboard
Published August 17
We had talked to Schmartboard about their new, patented manufacturing technique previously, but when we featured it in the Daily Newsletter, readers responded.
Indium Corporation Expert to Present at CHARGED EVs Virtual Conference
Published August 18
CHARGED EV’s virtual conference is focused on the electric vehicle supply chain. Indium’s Joseph Hertline’s presentation plans to—among other objectives—analyze the major challenges with substrate- and die-attach applications. It’s no wonder that readers looked into this news item.
Just Ask Joe: Optimum Copper Plating for Thermal Via Farms
Published August 19
Our “Just Ask” series continues with Joe Fjelstad’s debut. Joe is an icon in the industry, and for the next few weeks, he will periodically field questions about flexible circuits. To pose your own question for Joe Fjelstad, click here.
Altium Posts Positive Financial Growth in Fiscal Year Report
Published August 17
Electronic design software company Altium Limited delivered news of a solid financial performance. Readers who follow the design tool market certainly clicked through to read this news.
Tech Giant Apple Rises to the Top With $2 Trillion Stock Value
Published August 20
This news item starts with, “With so many more people working from home, the need for electronics has never been greater.” And now, with the exception of a Saudi oil company, no other company has ever been at a higher valuation. Find more details here.
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Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.