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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
August 21, 2020 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute

This week, the top five is full of progress in technology and financial performance. It’s more evidence that the electronics industry, at its core, continues to thrive.
I-Connect007 strives to create original content that sparks meaningful conversation inside the industry. Whether it’s our new “Just Ask” series—currently featuring Joe Fjelstad—news and articles that provoke thought, or coverage of new manufacturing techniques, we encourage you to share your reactions, opinions, and comments on the news we bring you. Your readership tells us what pieces interest you, and your comments tell us why. So, c’mon, let’s talk!
New Solder Joint Technology From Schmartboard
Published August 17
We had talked to Schmartboard about their new, patented manufacturing technique previously, but when we featured it in the Daily Newsletter, readers responded.
Indium Corporation Expert to Present at CHARGED EVs Virtual Conference
Published August 18
CHARGED EV’s virtual conference is focused on the electric vehicle supply chain. Indium’s Joseph Hertline’s presentation plans to—among other objectives—analyze the major challenges with substrate- and die-attach applications. It’s no wonder that readers looked into this news item.
Just Ask Joe: Optimum Copper Plating for Thermal Via Farms
Published August 19
Our “Just Ask” series continues with Joe Fjelstad’s debut. Joe is an icon in the industry, and for the next few weeks, he will periodically field questions about flexible circuits. To pose your own question for Joe Fjelstad, click here.
Altium Posts Positive Financial Growth in Fiscal Year Report
Published August 17
Electronic design software company Altium Limited delivered news of a solid financial performance. Readers who follow the design tool market certainly clicked through to read this news.
Tech Giant Apple Rises to the Top With $2 Trillion Stock Value
Published August 20
This news item starts with, “With so many more people working from home, the need for electronics has never been greater.” And now, with the exception of a Saudi oil company, no other company has ever been at a higher valuation. Find more details here.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.