The Big Picture: Our Big ‘Why’ in the Age of AI
The Chemical Connection: Through-glass Vias in Glass Substrates
It’s Only Common Sense: Why Sales Teams Fail (and How to Fix Them)
Isola Exhibits High-Reliability Copper-Clad Laminates at Virtual PCB West
September 8, 2020 | Isola GroupEstimated reading time: Less than a minute
Isola Group, the leading global and local manufacturer of copper-clad laminates and dielectric prepregs for use in the PCB boards announces it will participate in the virtual PCB West conference on September 9 and 10, 2020. The successful, long-running tradeshow was forced to go virtual this year due to COVID-19 pandemic and mandated social distancing
“In spite of the challenges of going virtual instead of face to face, Isola is presenting a broad array of products that are truly exciting for our customers,” commented Sean Mirshafiei, Isola Chief Sales & Marketing Officer. “We are exhibiting high speed digital products, like Tachyon® 100G, I-Tera® MT40, and I-Speed® that facilitate next generation designs. We will also be talking about our latest product development - our extremely low loss, halogen free laminate - TerraGreen® 400G. As circuit boards continue to become thinner, smaller, and faster, OEM designers are demanding a new breed of materials with lower loss and lower Dk to design and build boards that were never before possible.”
In addition to the HSD dielectric materials for advanced designs, Isola will also present other Halogen-free, high-reliable FR-4, and RF/Microwave laminates.
Share on:
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.