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Ucamco Releases Integr8tor v2020.08, Introduces UcamX Workflow Edition
September 14, 2020 | UcamcoEstimated reading time: Less than a minute
Ucamco is happy and proud to present Integr8tor v2020.08. The newest release comes with a series of significant improvements, including the brand new UcamX Workflow Edition (WE) Graphics Editor.
With this new product, you can:
- Eliminate duplicate layers from the job stackup
- Add gold mask or peel-off layers to the job that are not available in the customer archive
- Merge split layers together (e.g. 1 layer with pads – 1 layer with traces to make for 1 physical copper layer)
- Read in the odd legacyGerber data set that still comes with old-school aperture lists
- Examine netcompare errors reported by the AutoReference option
- Simplify user experience by bringing a series of repetitive edits together in a small script under singleclick button on the customizable toolbar
Integr8tor v2020.08 is now available for download. We recommend that you upgrade to this new version at your earliest possible convenience. More information is available at Ucamco.com.
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The Chemical Connection: Reducing Etch System Water Usage, Part 2
05/02/2024 | Don Ball -- Column: The Chemical ConnectionIn my last column, I reviewed some relatively simple ways to reduce water usage in existing etch systems: cutting down cooling coil water flow, adding chillers to replace plant water for cooling, lowering flow rate nozzles for rinses, etc. This month, I’ll continue with more ways to control water usage in your etcher. Most of these are not easily retrofittable to existing equipment but should be given serious consideration when new equipment is contemplated. With the right combination of add-ons, it is possible to bring the amount of water used in an etch system to almost zero.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.
Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.