Global Citizenship: Cultivating Cross-border Partnerships With Integrity
Nolan’s Notes: Moving Forward With Confidence
The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
ASM Opens Up New Possibilities in High-Volume Solder Paste Printing
September 24, 2020 | ASM Assembly SystemsEstimated reading time: 2 minutes
With an update, technology leader ASM presents additional functions for its high-volume DEK TQ printer, which sets new records in terms of speed, floor space performance and wet-printing accuracy. With its perfectly matched combination of print head, paste dispenser and innovative understencil cleaning system, the DEK TQ can operate for up to 8 hours without an operator assist. With its new hardware and software options, the printer features even more capabilities now. The innovations comprise its offline programming, the DEK TQ V1 operating software, the High Flow Vacuum board support system, and the intelligent and flexible verification and traceability functions.
With new options and software enhancements, technology leader ASM further improves the operability and capabilities of its DEK TQ stencil printer. The High Flow Vacuum function, for example, provides an affordable and highly efficient board support solution for the high-volume production of small and highly complex PCBs.
The new and highly flexible and intelligent verification function allows the verification of all printer materials either by means of the ASM OIB, with an interface to a higher-level MES (ideal for testing and releasing the solder paste) or individually selectable against a reference on the DEK TQ for supports, squeegees, etc.
Together with the sophisticated traceability functions, this provides an ideal connection of the DEK TQ to the Smart Factory.
New software
The DEK V1 station software and SIPLACE Pro have been revised from the ground up. With ASM Printer Programming and its integration into SIPLACE Pro, central program management is being raised to a new level. Printing programs are now administered across lines, printing and placement programs downloaded jointly to SMT lines, and each printer’s features are verified automatically before a program is executed.
DEK TQ – the standard for high-volume production
The DEK TQ sets new standards in performance, efficiency and precision. In a footprint of only 1.3 by 1.0 meters, the high-volume printer achieves a core cycle time of as little as five seconds for maximum throughput. With its use of precise linear drives, off-belt printing, innovative clamping systems and an advanced print head, the DEK TQ achieves a wet-printing accuracy of ±17.5 µm @ 2 Cpk – more than enough to reliably print the pads for 0201 metric components and modern ultra-fine-pitch applications. Each machine comes with an external capability certification. Open interfaces like IPC-Hermes-9852, Closed-Loop-to-SPI, ASM OIB and IPC CFX make it easy to integrate the DEK TQ into a smart integrated factory. They also deliver additional investment protection. With its highly efficient understencil cleaning system featuring an extra-large fabric roll and additional tanks as well as its automatic print head and dispenser system, the printer can run for up to 8 hours with no operator assist.
Share on:
Suggested Items
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.