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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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I-Connect007 Editor's Choice: Five Must-Reads for the Week
November 6, 2020 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
This past week, we published a variety of articles, interviews, and columns—and readers definitely made their favorites known. There was good news about hiring and staffing. (In case you were wondering, there are quite a few open positions in this industry right now.) We touched base with a pair of young engineers to get their thoughts on what it’s like for recent grads working in the PCB manufacturing community.
We learned about a company’s new program that can help take some of the stress out of NPI. We also launched a new chapter in our “Just Ask” series, this time starring columnist Tara Dunn. And there was sad news that a contract manufacturer’s chairman had just passed away.
Next week, Nolan Johnson will bring you his editor’s picks.
Survey Results: ‘Are You Currently Hiring?’
Published November 4
There’s still plenty of uncertainty in the world—we Americans don’t even know who our next president is yet, but our industry is doing well. According to our recent survey, many of your companies are hiring quite a bit. A lot of good things have been happening in PCB design and manufacturing this year, and it’s clear that we’re going to need to ramp up our hiring game for 2021. This article by Michelle Te drew quite a few readers this week.
Just Ask Tara Dunn: What’s Next for LCP Materials?
Published November 5
Our “Just Ask” series has a new face—Tara Dunn, president of Omni PCB and a Flex007 columnist. Tara focuses on flex and rigid-flex technologies, as well as additive processes and cool, cutting-edge laminates. Her first question in this series addresses the growth of liquid crystal polymer. Do you think LCP will ever replace polyimide as the flex substrate of choice? “Just Ask” remains one of our more popular features.
Cicor Mourns Death of Chairman Heinrich J. Essing
Published November 2
Heinrich J. Essing, chairman of the board of directors for Cicor Technologies, passed away unexpectedly this week. The Swiss provider of flex and rigid circuit board manufacturing and assembly services announced that the vice-chair would assume his duties temporarily. Essing had been on the board since 2009. Essing continued working after retirement age and was “an extremely loyal and committed chairman and a highly esteemed person.”
Foundations of the Future: Inspirational Career Paths—Meet Tayler and Olivia
Published November 3
In this column, IPC’s Charlene Gunter du Plessis interviews two upcoming young engineers: Tayler Swanson and Olivia Lim. They discuss the highlights of their careers so far and offer advice for other young people considering a career in technology. We need many more young technologists like them; IPC’s Emerging Engineer Program is one organization that’s dedicated to mentoring recent engineering graduates.
PCB Technologies Focuses on an All-in-One Solution
Published November 3
Launching a new product is always a stressful event, especially having to manage the information flowing between designers, fabricators, and assembly providers. In this interview, Arik Einhorn of PCB Technologies discusses his company’s “All-in-One” solution, which takes away much of the NPI customer’s worries by managing the entire process, from PCB design through PCBA—all through a single point of contact at his company. This was another one of our more popular articles.
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SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and GlobalFoundries.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.