Trouble in Your Tank: Understanding Interconnect Defects, Part 1
It’s Only Common Sense: Marketing Isn’t Fluff, It’s Ammunition
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
I-Connect007 Editor's Choice: Five Must-Reads for the Week
November 20, 2020 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
This week, we’ve covered a variety of bases in our newsletters and websites. In my top five picks, we have news about columnist Tara Dunn moving to Averatek to work with their A-SAP additive processes, and an interview with Audrey Sim regarding the “hybrid” model adopted by the HKPCA for its upcoming Electronic Circuits World Convention.
We also have a compilation of the questions that readers have asked Joe Fjelstad and news about DownStream Technologies adding support for flex, rigid-flex, and embedded component designs. Finally, we share a review of some of KYZEN’s new training sessions on cleaning electronic assemblies—virtual courses that pack a lot of information into 15-minute snapshots. Knowing how tight everyone’s schedules are now, 15-minute events might be the ticket.
Just Ask Joe Fjelstad: The Exclusive Compilation
Published November 19
Our “Just Ask” series continues to be popular with readers from across the electronics development spectrum, and columnist Joe Fjelstad was happy to answer your queries about topics new and old. There’s a thirst for knowledge in our industry, and we’ll keep bringing you the experts who have the information you need.
HKPCA’s Audrey Sim Details Upcoming Electronic Circuits World Convention
Published November 18
After covering a variety of virtual trade shows this fall, I can’t say I’m shocked to see the Hong Kong Printed Circuit Association holding their 2020 Electronic Circuits World Convention as both a virtual and physical show. In this interview, Audrey Sim of HKPCA details this hybrid event, which will be virtual for all three days, while the last day’s forum will also be a live event. This might be a great model for trade shows as we move forward. The show takes place from November 30 through December 2.
New DownStream Software Supports Flex, Rigid-Flex, and Embedded Component Designs
Published November 17
Flex and rigid-flex keep marching on, making inroads into many of our military, aerospace, and household devices. Now, DownStream Technologies has added support for flex, rigid-flex, and embedded component designs to their CAM350, DFMStream, and BluePrint-PCB flows. DownStream will now support importation and visualization of flex, rigid-flex, and embedded designs in 2D and 3D.
High-Tech, High-Value Cleaning Answers Made Easy With KYZEN’s Tech-2-Tech
Published November 19
This summer, KYZEN introduced its Tech-2-Tech training initiative, a series of 15-minute virtual sessions focused on cleaning electronic assemblies. In this review, Technical Editor Pete Starkey discusses his takeaways from a number of these training sessions, including “the five forces of cleaning” and how surprised he was to learn so much in a quarter of an hour. One upcoming holiday session will cover “Smart pH Employment in Electronic Cleaning: What Is the pH of Eggnog?”
Tara Dunn Transitions to New Role at Averatek
Published November 19
Tara Dunn recently joined Averatek, the company that created the A-SAP high-density additive manufacturing process. In this interview with Editors Michelle Te and Nolan Johnson, Tara discusses her new role as vice president of marketing and development at Averatek and why she believes that the additive process represents the future of high-density PCB manufacturing.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Nortech Systems Incorporated Earns AS9100 Certification for Monterrey, Mexico Facility
11/04/2025 | BUSINESS WIRENortech Systems, Incorporated, a leading provider of design and manufacturing solutions for complex electromedical devices and electromechanical systems, announced that its Monterrey, Mexico, facility has achieved AS9100:D certification.
PsiQuantum, Lockheed Martin Form Strategic Collaboration to Accelerate Quantum Computing for Aerospace and Defense
11/04/2025 | BUSINESS WIREPsiQuantum and Lockheed Martin have signed a memorandum of understanding (MoU) to accelerate the development of quantum computing applications in aerospace and defense.
Aircraft Wire and Cable Market to surpass USD 3.2 Billion by 2034
10/30/2025 | Global Market Insights Inc.The global aircraft wire and cable market was valued at USD 1.8 billion in 2024 and is estimated to grow at a CAGR of 5.9% to reach USD 3.2 billion by 2034, according to recent report by Global Market Insights Inc.
Honeywell Announces Updated Business Segment Structure Ahead Of Aerospace Spin-Off
10/28/2025 | HoneywellHoneywell announced its updated business segment structure ahead of the planned separation of its Aerospace Technologies business, expected in the second half of 2026, and its Solstice Advanced Materials business, expected to be completed on October 30, 2025.
Lockheed Martin Signs Strategic Partnership Framework with Korean Air
10/28/2025 | Lockheed MartinLockheed Martin is collaborating with Korean Air to explore opportunities to support the U.S. government’s (USG) Regional Sustainment Framework (RSF) initiative, as well as expand Maintenance, Repair, Overhaul & Upgrade (MROU) cooperation to third-country markets.